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Pin in Paste Plus Preforms to Eliminate Wave Soldering
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Authored By:Guhan Subbarayan, Scott Priore Assembly Sciences and Technology, Cisco Systems, Inc. San Jose, CA USA Paul Koep, Scott Lewin, Rahul Raut Cookson Electronics - Assembly Materials South Plainfield, NJ and Elgin, IL USA Sundar Sethuraman Jabil Circuits, San Jose, CA USA TranscriptPin in Paste technology is the process of soldering through hole components using the surface mount technology reflow process. One of the primary advantages is lowering of cost due to the elimination of the wave soldering process and its associated tooling cost and potential handling damage. Another advantage is that with the wave soldering process, it is extremely difficult to achieve adequate hole-fill on thermally challenging thick PCBs. However, by using the Pin in Paste process with a combination of solder preforms, it is possible to achieve adequate hole-fill and reliable solder joints. The objective of this study was to investigate the use and limitations of machine-placed solid solder preforms during the top-side SMT reflow process for through-hole components. The study reveals how the Pin in Paste process with a combination of solder preforms is an attractive option for soldering through hole components, as it provides several benefits over the conventional wave soldering process. However, there are some challenges that need to be addressed before implementation in high volume production. The primary challenge is designing the through hole components for the Pin in Paste process. The component suppliers must redesign the component to withstand SMT reflow temperature and provide adequate standoff underneath the component for placement of solder preforms. Initially Published in the IPC Proceedings |
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