Electronics Assembly Knowledge, Vision & Wisdom
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Study investigates use and limitations of machine placed solder preforms during the top-side SMT reflow process for PTH components.
Production Floor

Authored By:
Guhan Subbarayan, Scott Priore
Assembly Sciences and Technology, Cisco Systems, Inc.
San Jose, CA USA

Paul Koep, Scott Lewin, Rahul Raut
Cookson Electronics - Assembly Materials
South Plainfield, NJ and Elgin, IL USA

Sundar Sethuraman
Jabil Circuits, San Jose, CA USA
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Pin in Paste technology is the process of soldering through hole components using the surface mount technology reflow process.  

One of the primary advantages is lowering of cost due to the elimination of the wave soldering process and its associated tooling cost and potential handling damage.  

Another advantage is that with the wave soldering process, it is extremely difficult to achieve adequate hole-fill on thermally challenging thick PCBs.  

However, by using the Pin in Paste process with a combination of solder preforms, it is possible to achieve adequate hole-fill and reliable solder joints.  

The objective of this study was to investigate the use and limitations of machine-placed solid solder preforms during the top-side SMT reflow process for through-hole components.  

The study reveals how the Pin in Paste process with a combination of solder preforms is an attractive option for soldering through hole components, as it provides several benefits over the conventional wave soldering process.  

However, there are some challenges that need to be addressed before implementation in high volume production.
The primary challenge is designing the through hole components for the Pin in Paste process. The component suppliers must redesign the component to withstand SMT reflow temperature and provide adequate standoff underneath the component for placement of solder preforms.
Initially Published in the IPC Proceedings
Reader Comment

I was going through the paper presented for Pin in paste process with combination of solder preforms to eliminate wave soldering which was presented in IPC APEXconference,lasvegas,2011. I have few question for this.

(1) How was the equation length of solder paste pushed inside barrel printing=21.4+0.6*Hole diameter reached?
(2) What is the unit for above length of solder paste? Is it mils? It's not volume correct?
(3) If it is length, how do we calculate volume of solder paste pushed inside barrel during printing?
(4) If we use preform, can we reduce the size of paste aperture? If yes, how do we calculate size of preform?

KALPANA DESAI, Flextronics, Inc.
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