Electronics Assembly Knowledge, Vision & Wisdom
Understanding Surface Insulation Resistance
Understanding Surface Insulation Resistance
This paper covers differences between two common surface insulation resistance (SIR) specifications J-STD-004A and J-STD-004B.
Materials Tech

Authored By:
Chris Nash, Technical Support Engineer
Eric Bastow, Senior Technical Support Engineer
Indium Corporation
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR
coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.

We will also discuss the differences between two of the industry's most common SIR specifications J-STD-004A and -004 B. The subjective nature of SIR testing on water washable/soluble materials will also be reviewed. In addition, testing for SIR when the assembly process has multiple residue sources, such
as paste, wave solder flux, rework flux, etc., will be considered.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Young Laplace Equation Reveals New Possibilities Thermal Pad Design
bullet Embedded Components: A Comparative Analysis of Reliability
bullet New High-Performance Organophosphorus Flame Retardant
bullet Is HASL a Good Choice for Surface Finish?
bullet Challenges on ENEPIG Finished PCBs
bullet MELF Component Misalignment
bullet Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
bullet Influence of Copper Conductor Surface Treatment for High Frequency PCB
bullet Connector Design for Wearables
bullet Semi-Additive Process for High Frequency Signal Substrates
More Related Programs