Electronics Assembly Knowledge, Vision & Wisdom
Vapour Phase - Profiling for Lead-Free Alloys
Vapour Phase - Profiling for Lead-Free Alloys
This paper covers the profiling gap with thermal control techniques to address profiles meeting paste manufacturer recommendations.
Production Floor

Authored By:
Allen Duck
A-Tek LLC, Berthoud, CO, USA

Claus Zabel
Asscon Systemtechnik
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Vapour Phase has seen resurgence in its use recently. In large part this has been a result of new chemistry and the advances in the technology to manage energy flow from the source to the PCB via the vapour. Added the demand from the customer base is again present as we deal with density challenges in PCB design, Parts design as well have to contend with new alloys that are less forgiving than the old traditional 63/37.
Conclusions
The end result of such a mechanism is the freedom to create any shape recommended profile and retain the extremely beneficial characteristics that Vapour Phase offers.
  1. O2 free environment.
  2. Controlled ramp rates.
  3. Low or zero delta Ts at peak
  4. Direct thermal communication with I/O under array packages.
  5. Lower power consumption.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Components Jumping Around During Reflow
bullet What is the Life Span of a Profile Board?
bullet Tiny Solder Balls After Reflow
bullet QFN Open Solder Joints
bullet Void-Free Soldering With Vapor-Phase Vacuum Tech
bullet BGA BAll Sheer Testing
bullet How to Reduce Voiding on QFN Components
bullet Understanding PCB Design Variables That Contribute to Warpage
bullet Why Do Our Boards Warp During Reflow?
bullet Tips When Moving a Reflow Oven
More Related Programs