Electronics Assembly Knowledge, Vision & Wisdom
Vapour Phase - Profiling for Lead-Free Alloys
Vapour Phase - Profiling for Lead-Free Alloys
This paper covers the profiling gap with thermal control techniques to address profiles meeting paste manufacturer recommendations.
Production Floor

Authored By:
Allen Duck
A-Tek LLC, Berthoud, CO, USA

Claus Zabel
Asscon Systemtechnik
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Vapour Phase has seen resurgence in its use recently. In large part this has been a result of new chemistry and the advances in the technology to manage energy flow from the source to the PCB via the vapour. Added the demand from the customer base is again present as we deal with density challenges in PCB design, Parts design as well have to contend with new alloys that are less forgiving than the old traditional 63/37.
Conclusions
The end result of such a mechanism is the freedom to create any shape recommended profile and retain the extremely beneficial characteristics that Vapour Phase offers.
  1. O2 free environment.
  2. Controlled ramp rates.
  3. Low or zero delta Ts at peak
  4. Direct thermal communication with I/O under array packages.
  5. Lower power consumption.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Methods to Get Volatile Compounds Out of Reflow Process
bullet Proper Exhaust Pressure for Reflow Ovens?
bullet Vapor Phase Quality Improvement
bullet Evaluating Accuracy of Thermocouple Attach Methods
bullet Max Interval Between Reflow for OSP Boards
bullet Rechecking Thermal Profiles
bullet Reflow For Rigid Flex
bullet A Generic Reflow Profile
bullet What Causes Component Rotation During Reflow?
bullet Double Reflow-Induced Brittle Interfacial Failures
More Related Programs