Electronics Assembly Knowledge, Vision & Wisdom
Dispensing Underfill Can Be Tricky Business
Dispensing Underfill Can Be Tricky Business
Dispensing underfill can be a tricky process due to the fluctuating temperature in the work envelope.
Production Floor

Authored By:
Christian Vega
GPD Global
Grand Junction, CO 81505 USA
,{url:'http://www.circuitinsight.com/videos/dispensing_underfill.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Transcript

Dispensing underfill can be a tricky process due to the fluctuating temperature in the work envelope.

With fluctuating temperature comes changes in the fluid viscosity that result in varying dispense volumes, and in many cases, dripping and fluid adhering to the nozzle.

The heated environment affects the underfill fluid in two ways.

First, it reduces the viscosity, and if exposed to an elevated temperature for a prolonged period of time, decreases the pot life, which increases the viscosity. This change in fluid properties creates volumetric consistency and dispense quality issues over the life of the syringe and production process. By using a pump that is continuously volumetric in nature, an improvement in the dispense process can immediately be realized.

A volumetric pump will dispense consistent volumes of fluid even as the viscosity changes. This means operators will not need to make adjustments to the fluid pressure or dispense rate.

The implementation of a continuously volumetric dispense pump results in less setup time, less time spent doing multiple calibration procedures, less wasted fluid, significantly less time doing rework and the pump will not need to recharge at an inconvenient time.

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