Electronics Assembly Knowledge, Vision & Wisdom
Tip For Non-Destructive BGA Profiling
Tip For Non-Destructive BGA Profiling
How can you measure a BGA component thermal profile without destroying the BGA component in the process?
Analysis Lab

Authored By:
Bjorn Dahle, President, KIC
16120 W Bernardo Drive
San Diego, CA 92127 USA
,{url:'http://www.circuitinsight.com/videos/thermocouple_tape.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();

How can you measure a BGA component thermal profile without destroying the BGA component in the process?

The Rochester Institute of Technology recently conducted a comprehensive study to measure whether there was any correlation between the temperature underneath a BGA component using a flat bead thermocouple, and a thermocouple attached on top of the component using aluminum tape.

A correlation was indeed found, which means that electronic assemblers can attach a thermocouple on top of the BGA component and use an offset to determine the temperature underneath. When attaching the thermocouple with aluminum tape, which can be peeled off afterwards, you can profile the BGA in a non destructive way.

The offset is dependent on each particular application. A free Excel calculator is available from KIC which enables a user to identify the offset specific to the application.

Tip For Non-Destructive BGA Profiling

For more information see:

Temperature Difference Calulator By KIC

Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Cause of SMT Component Shift?
bullet What Causes Component Rotation During Reflow?
bullet Understanding Reflow for Metal Core PCBs
bullet Solder Bridging on BGAs
bullet Going Lead Free with Vapor Phase Soldering
bullet Reflow Optimization for MLP Components
bullet Best Practices - Reflow Profiling for Lead-free
bullet Evaluating Accuracy of Thermocouple Attach Methods
bullet How Many Zones Needed for Lead-free Profile?
bullet Profiling for Double Sided BGA
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication