Electronics Assembly Knowledge, Vision & Wisdom
Touch Screen Assembly Using Adhesives
Touch Screen Assembly Using Adhesives
Paper covers a novel anisotropic conductive film bonding process using ultrasonic vibration for touch screen panel applications.
Production Floor

Authored By:
Kyung-Wook Paik, Seung-Ho Kim, Kiwon Lee
Nano Packaging and Interconnect Lab.
Department of Materials Science and Engineering
Korea Advanced Institute of Science and Technology, Daejeon, Korea
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
A novel anisotropic conductive film (ACF) bonding process using ultrasonic vibration was investigated in touch screen panel(TSP)-on-board (TOB) applications. The ACF temperature increased as the U/S power increased and the bonding pressure decreased. The ACF temperature was successfully controlled by adjusting both U/S power and bonding pressure. The significant meaning of this result is that the ACF bonding process can be remarkably improved by U/S bonding compared with conventional T/C bonding. Using the optimized U/S bonding parameters, the ACF interconnects showed significantly less thermal damages to PET substrates and similar bonding performances as T/C bonding in terms of the contact resistance and the adhesion strength. And the cure degree of adhesive resin was achieved 90% at 3 sec.

In terms of thermal deformation, U/S bonding showed no severe thermal deformation of TSPs up to 120°C which is much higher than Tg of PET substrates. This result indicates that ACA can be heated up to 120°C without severe thermal deformation of the PET substrates by VUS. It is presumably due to the rapid heating rate and the short bonding time of VUS bonding. As a summary, the VUS method can be successfully used in touch screen assembly with high speed and good reliability.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
bullet Conformal Coating Cross Contamination
bullet Conductive Epoxy: Pros and Cons
bullet Glued SMT Components Falling Off
bullet How To Verify Cleanliness After Rework and Prior to Re-coating?
bullet SMT Adhesive Inspection
bullet Signal Loss in a High Speed High Frequency Transmission Line
bullet Exposed Leads on Conformally Coated Boards
bullet Un-cleaned PCB Assemblies Potted
bullet Dewetting of Acrylic Conformal Coating
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication