Authored By:
Henry H. Utsunomiya
Interconnection Technologies, Inc.
Suwa City, Japan
Summary
This presentation will outline the market dynamics driving the development of advanced substrates in today's industry landscape. Technological advancements have shifted from Personal Computers to Mobile Applications like Cellular phones, MPEG players, etc. An overview of the technology revolution of substrates and their corresponding packages will be discussed in terms of technology supply chain matching: assembly technology, substrate technology and system technology. Advanced substrate technology roadmaps of leading Japanese suppliers will be reviewed.
The evolution of buildup substrates, which have standardized under the direction of CPU & FPGA manufacturers will be explained. The two technological directions of substrates for advanced electronic packages will be mapped out: miniaturization and functional integration, and explained in terms of "More Moore" and "More than Moore", respectively. Fine pitch wiring on substrates can be combined with embedded active and passive devices and has been proven as a technology. Examples/ illustrations of advanced substrate applications in servers, hand -helds, and high end servers and communication equipments will be reviewed: PoP, Embedded Active Devices, Si interposers and Wafer Level Packages, etc.
Conclusions
In the next 5 years, the technology of packaging substrate will drive by flip chip interconnection technology with significant higher pin counts and embedded active and passive devices for System in Package. As a result, organic substrate will face technology limitation and silicon interposer or glass substrate will be introduced for high-end applications. In addition, organic substrate using buildup layers will approach minimum line width/space of 5 m/5 m with less than 30m to 5m via diameter.
Table 12 is addressed very advance PWB business structure comparison between last 5 years and next 5 years.
The difficulty of advanced PWB business is capital investment that is tremendous huge for finer wiring board production such as 200 million US$ to 500 million US$ for 50,000 m2 out put /monthly production factory from scratch. However, active devices embedded into printed wiring boards have potential solution to increase functional density without ultra finer wiring. Both finer wiring technology and integrated function into board level will be coexisted in next 5 years. To accomplish this scheme, infrastructural enhancement of materials, manufacturing technologies, quality assurance and modeling and simulation to advanced packaging substrate as well as embedded active devices are necessary
Initially Published in the SMTA Proceedings
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