Electronics Assembly Knowledge, Vision & Wisdom
Assembly Options for Handheld Products
Assembly Options for Handheld Products
Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible.
Production Floor

Authored By:
Jonas Sjoberg
Flextronics Mobile & Consumer
Shah Alam, Malaysia

Andreas Morr
Flextronics Mobile & Consumer
Hong Kong, China
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Miniaturization and the integration of a growing number of functions in portable electronic devices require a high packaging density for electronic components. One way to increase the packaging density is to reduce the size of the packages and at the same time increase the density of the I/Os. This means that the size and pitch of solder balls or pads in electronic component packages will continue to shrink.
The use of fine pitch components, equal and below 0,5mm pitch, poses a number of challenges for design, SMT assembly process and reliability.

First, a feasible assembly process must be achieved. The assembly process ranges all the way from screen-printing too in many cases underfill of CSP's and LGA's. Many factors influence the quality of the assembly process. The basic processes to control are screen-printing, pick & place, reflow soldering and underfill.

Second, the right materials (such as PCB material, PCB surface finish, solder paste and underfill) and PCB design need to be selected to ensure a cost effective and reliable interconnect. Of coarse the mechanics of the products makes a big difference as well but it is very product dependent and many of today's products leave little room for designing the mechanics in the most reliable way due to total cost and overall looks of the product.

This paper will discuss different assembly and material alternatives to make a handheld product as producer friendly, cost effective and reliable as possible.
There are many ways to achieve miniaturization and the key is to have a "tool box of technologies" to be able to fulfill the needs. Depending on the product several options can be considered and the selection should be based on data on assumptions.

In addition to the technologies mentioned in this paper, there are other technologies such as hot-bar soldering, integrated active and passive parts and COB with wire bonding that could be interesting for a miniaturization and cost point of view.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
bullet Gold Stud Bump Flip Chip Bonding on Interconnect Devices
bullet Beyond 0402M Placement: Considerations for Microchip Mounting
bullet Solder Paste Stencil Design for Optimal QFN Reliability
bullet Solder Paste Printing First Pass
bullet Choosing the Right Stencil Options
bullet Investigation into Printing Miniaturized Devices
bullet Challenges of Manufacturing with Printed Circuit Board Cavities
bullet 0201 Pick & Place Nozzle Plugging
bullet Top 5 BGA Rework Challenges to Overcome
More Related Programs