Equipment/services for direct mounting and multichip modules. Directory listing are sorted alphabetically.
Air-Vac Engineering Company, Inc.
Air-Vac Engineering develops innovative solutions for almost every type of SMT Rework, Repair, Micro Assembly, Dispensing and Selective Soldering Challenge. Air-Vac continues to develop systems
Altaflex is a trusted supplier for customers who demand quality, service, on-time delivery, and value. Altaflex’s goal is to supply prototypes similar in quality and
AMICRA Microtechnologies GmbH
We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and
Amkor Technology, Inc.
Amkor is a strategic contract manufacturing resource for many of the world's leading semiconductor companies. We have developed unique expertise in high-volume manufacturing techniques and
ASM Pacific Technology
ASM Pacific Technology strives to be the leading integrated system and materials supplier to the global microelectronics industry, offering complete factory automation solutions to customers
Assembleon America, Inc.
Assembleon is a global supplier of Surface Mount Technology Pick & Place solutions for the electronics manufacturing industry. Assembleon is a trustworthy partner, providing full
Assembleon Netherlands B.V.
Assembleon is a global supplier of Surface Mount Technology (SMT) Pick & Place solutions for the electronics manufacturing industry. Assembleon is a trustworthy partner, providing
Besi North America, Inc.
BE Semiconductor Industries N.V. (Besi) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries.
The Company develops leading edge
Datacon Technology GmbH
Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international
Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions and electro/mechanical equipment. As a successor to IBM's microelectronics division in
Finetech offers innovative, high precision equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages.
Discover the equipment
Flip Chip International
FlipChip International, LLC is dedicated to the protection of the environment and the health and safety of our employees, customers, contractors, suppliers and the communities
Harting, Inc. of North America
The HARTING Technology Group is skilled in the fields of electrical, electronic and optical connection, transmission and networking, as well as in manufacturing, mechatronics and
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine
Hybrid Design Associates, Inc.
HDA/SMC has been providing high quality hybrid circuits and surface mount products to the communications, agriculture, and down hole oil well logging industries.
Labtech Microwave is one of the world's leading manufacturers of microwave circuit solutions with specialist capabilities in design, manufacturing, assembly and testing across many technologies,
Medallion Technology, LLC
Featuring a revolutionary true z-axis interconnect technology. Our solderless Twisted Wire Interconnect "TWI" is an innovative solution that can be utilized in any design where
Micropac Industries, Inc.
Micropac Industries, Inc. provides microelectronic and optoelectronic components and modules along with contract electronic manufacturing services.
The Company offers a wide range of products to
Nordson ASYMTEK, a world leader in precision automated fluid dispensing, conformal coating, and jetting technologies, designs and manufactures a full line of dispensing and coating
Pac Tech builds solder balling and assembly equipment for flip-chip and chip-scale packaging. With systems for solder jetting (SB2) and flip-chip attach (LAPLACE) Pac Tech