Electronics Assembly Knowledge, Vision & Wisdom
Die & Wire Bonding << Page 1 of 1 >>
Equipment/services for attaching semiconductor die to packages.

Directory listing are sorted alphabetically.
ASM Pacific Technology
ASM Pacific Technology strives to be the leading integrated system and materials supplier to the global microelectronics industry, offering complete factory automation solutions to customers
Datacon Technology GmbH
Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international
Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions and electro/mechanical equipment. As a successor to IBM's microelectronics division in
F & K Delvotec Inc.
F & K Delvotec Inc.
F&K Delvotec is a respected technological leader in the field of Automated Assembly Equipment for the Microelectronic Industry. Having started with the classic die attach
Fabrinet
Fabrinet
Fabrinet is a provider of precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers (OEMs) of complex products such as optical communication components,
Finetech
Finetech
Finetech offers innovative, high precision equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages. Discover the equipment
Hesse Mechatronics
Hesse Mechatronics
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine
i2a Technologies
i2a Technologies offers a range of assembly solutions to meet your IC Packaging needs utilizing wire bonding and wafer bumping technologies in a variety of
Kulicke & Soffa Industries Inc.
Kulicke & Soffa Industries Inc.
Kulicke & Soffa is the world's leading supplier of semiconductor assembly equipment, tools and materials. We invite you to take a closer look at our
Micro Point Pro LTD
Micro-Point Pro Ltd. (MPP), former K&S Micro-Swiss Wedge & Die Attach Tools division, was founded in 2010. MPP has established itself as a global leader
Oerlikon Esec
Oerlikon Esec
Oerlikon Esec is a leading global provider of chip assembly equipment, processing techniques and system solutions for the semiconductor industry. Our equipment and solutions are
Orthodyne Electronics
Orthodyne Electronics
For more than 30 years Orthodyne Electronics has been a leader in the design, manufacture and marketing of wire bonding equipment for the semiconductor, automotive,
Palomar Technologies, Inc.
Palomar Technologies, Inc.
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and
Questar Products International, Inc.
Questar Products International, Inc.
Questar Products International is the leader in affordable, user friendly automatic wire bonders. Our unique approach to building fine pitch, flexible machines has solved the
SET Smart Equipment Technology
SET Smart Equipment Technology
SET is the world's leading supplier of High Accuracy Die to Die & Die to Wafer Bonders. With more than 300 bonders installed worldwide, SET
Texmac Inc.
TEXMAC brings its solutions formula to a diverse array of industrial segments, yet does so with a unified focus: offer only the highest-quality solutions in
Tresky AG
Tresky AG
Since 1980, the Dr. Tresky AG company has been supplying the micro and opto electronics industry with innovative component placers and die bonders. Over 900
Umicore AG & Co. KG
Umicore AG & Co. KG
Umicore Electronic Materials is the efficient partner for the development and production of materials for the electronic manufacturing. Microbond offers a complete spectrum of products
Ziptronix
Ziptronix
Ziptronix, a leader in developing next-generation semiconductor integration strategies and processes, makes tomorrow’s high performance IC applications available today. Based on the patented room temperature
Die & Wire Bonding << Page 1 of 1 >>
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