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MicroCircuit Laboratories LLC
MicroCircuit Laboratories hermetic package sealing solutions for air leak rates E10 atm-cm3/sec, lower than the most stringent requirements per MIL-STD 883 Test Method 1014 for Class K devices.

Design, Develop, Production from Pilot to HVM for Photonics, Compound Semiconductor, MEMS, Microwave, Power and Semiconductor in hermetic encapsulated devices with the lowest total cost.
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Address
Kennett Square, PA 19348
Website Links
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Directory Categories
  Packaging & Encapsulating

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