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Stats ChipPac
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packaging, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. STATS ChipPAC differentiates itself through innovative packaging solutions in embedded Wafer Level Ball Grid Array (eWLB), encapsulated Wafer Level Chip Scale Packaging (eWLCSP) and fcCuBE® technology as well as our breakthrough wafer level manufacturing method known as FlexLineTM.
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46429 Landing Parkway Fremont, CA 94538
Lisa Lavin
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