SPONSOR
Research & Technical Papers
No Recent Research Postings.
More Information
No Additional Information.
i2a Technologies offers a range of assembly solutions to meet your IC Packaging needs utilizing wire bonding and wafer bumping technologies in a variety of package families.
Presentations

i2a Technologies

SPONSOR
Press Releases
Contact Information
3399 West Warren Ave,
Fremont, CA 94538
WEBSITE
UPDATE THIS LISTING