Electronics Assembly Knowledge, Vision & Wisdom
Quik-Pak, a division of Delphon Industries, provides IC Packaging and Assembly services. The company specialize in a variety of services that together provide a full turn-key solution including wafer preparation, die attach, wire bonding, remolding and marking/branding. Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die and MEMS.
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10987 Via Frontera
San Diego, CA 92127 USA
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  Flip Chip & Multichip
  Semiconductor Materials

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