Electronics Assembly Knowledge, Vision & Wisdom
PacTech Technologies
Pac Tech builds solder balling and assembly equipment for flip-chip and chip-scale packaging. With systems for solder jetting (SB2) and flip-chip attach (LAPLACE) Pac Tech is the leader in laser heating and reflow technology for advanced packaging applications like HGA assembly, MEMS and optoelectronic packaging.

The solder bump repair system SB2-R is the solution for lead-free CSP/BGA rework. Pac Tech also offers contract bumping & backend services for quick-turn and mass production in Santa Clara-California, Penang-Malaysia and Nauen-Germany.
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PacTech Technologies
Am Schlangenhorst 15-17
14641 Nauen, Germany
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Directory Categories
  Flip Chip & Multichip
  Semiconductor Materials

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