Electronics Assembly Knowledge, Vision & Wisdom
Ziptronix, a leader in developing next-generation semiconductor integration strategies and processes, makes tomorrow’s high performance IC applications available today.

Based on the patented room temperature wafer bonding process, ZiBond and Direct Bond Interconnect (DBI) enable 3D architectures with the smallest footprint and the smallest volumetric size of any technologies available.
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800 Perimeter Park Drive
Suite B
Morrisville, NC 27560 USA
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