Electronics Assembly Knowledge, Vision & Wisdom
Diemat, Inc.
Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages. This technology replaces the more expensive soldering process, which requires fiber metallization. This low temperature glass technology is also utilized in hermetically sealing lenses for the optoelectronic industry, as well as hermetic sealing of package lids.
Programs
No Recent Program Postings
 
 
Address
19 Central Street
Byfield, MA 01922
Website Links
  Main Website Home Page
Directory Categories
  Adhesives & Sealants

Update This Listing
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication