In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations.
Our commitment to leadership and quality in wafer bumping solutions continues, ensuring that FlipChip remains the leader in developing, and bringing to market the latest in bumping technology. The primary bumping facility and technology development site for FlipChip is located in the World Headquarters building in Phoenix, Arizona, USA.
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