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Research & Technical Papers

Assembly Process Feasibility of Low Silver Solder Paste

This paper presents performance/process capability of various low/no silver alloy ...

Numerical Study on New Pin Pull Test for Pad Cratering

In this study a new pin pull test method with ...

AXI Applications with BTC and Connectors

What is the best way to use test and inspection ...

Press Fit Roadmap for High Performance Process

Paper investigates the roadmap for press fit technology, with attention ...

3D Assembly Processes a Look at Today and Tomorrow

This paper explores various technologies available today and some that ...

Selective Reflow Rework Process

This paper discusses some aspects of the process optimization and ...

Reliability Study of Low Silver Alloy Solder Pastes

Paper presents the reliability study of lead-free solder joints reflowed ...

Study on Solder Joint Reliability of Fine Pitch CSP

In the future more fine pitch CSP components will be ...

Head in Pillow X-ray Inspection at Flextronics

For the study we used two boards exhibiting HIP defects ...

Soldering Improvement for SMT Connectors

This paper covers experiments for improving the SMT process for ...

Comparison of SAC105 and SAC305 Solders

In this paper, the thermal fatigue performance under accelerated test ...

Assembly Options for Handheld Products

Paper covers assembly and material alternatives to make a handheld ...

Nano Tech Improves Critical Printing Process

Paper covers how nano coating over stencil openings will improve ...

Pad Cratering Evaluation of PCBs

This paper reviews major publications and research reports with regard ...

Creep Corrosion of PWB Final Finishes

This paper demonstrates that creep corrosion on a PWB is ...

Assembly Challenges of Bottom Terminated Components

This paper discusses the design, assembly and inspection challenges of ...

X-rays vs. Cross Sections to Measure Voids

This paper validates void measurements obtained from non-destructive imaging techniques, ...

Reliability of Multiple Pb-free Solder Ball Alloys

Paper covers a screening experiment to obtain data comparing thermal ...

Design of New Solder Attach Technologies

Paper outlines a new technology with a focus on design ...

Evaluation of Lead-free Solder Pastes

This paper discusses the strategy and methodology for selecting a ...

Test Optimization to Improve Rework

Paper reviews how to use test machines to diagnose defects ...

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Headquartered in Singapore, Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design, engineering and manufacturing services to automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEMs.

With the acquisition of Solectron, pro forma fiscal year 2008 revenues from continuing operations are more than US$33.6 billion.

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