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Research & Technical Papers
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, ...
Material Selection for Reliable TMV Pop Assembly
This paper investigates selected aspects of the above mentioned processes ...
A Model for Life of SnAgCu Solder Joints
Almost all reliability assessment is focused on the anticipated life ...
Reliability of Lead-Free LGAs and BGAs
A theory is proposed that substantial differences in SAC305 solder ...
Testing Intermetallic Fragility
Data is presented on the intermetallic strengths and failure modes ...
Reliability of Sn/Cu/Ni Solder Joints
Paper covers the electronics industry search for a single lead-free ...
Reliability Impact of Partial Pad Craters
PCB pad craters are associated with single overstress events that ...
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Universal Instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor, and back-end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the global electronics industry.

Our aim is a continuous and intelligent investment in research, and to develop processes, equipment, systems and software to bring electronic assembly to its current pinnacle of sophistication.
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