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Hesse Mechatronics
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly.

The company's automatic wedge bonders handle both light and heavy wire applications with aluminum, gold and copper round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR (High Current Ribbon). The company's product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company's equipment and commercial software packages.
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Hesse Mechatronics
Address
2305 Paragon Drive
San Jose, CA 95131 USA
Phone: 408-436-9300
Website Links
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  Die & Wire Bonding
  Flip Chip & Multichip

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