Reflow Soldering, Profiling



These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
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Reflow Oven Zone Separation Challenges
Reflow Oven Zone Separation Challenges
We recently purchased an oven profiler. Some of the zones are competing with each other to get to the correct temperature. How do I find prevent the oven from having competing zones while getting an accurate process? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this topic.
Board Talk

Double Reflow-Induced Brittle Interfacial Failures
Double Reflow-Induced Brittle Interfacial Failures
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints.
Analysis Lab

Connector Bowing During Reflow Process
Connector Bowing During Reflow Process
I have a connector that is bowing during the lead-free soldering process. When the connector is put through an oven on its own no bowing takes place. What is causing the connector to bow? Phil Zarrow and Jim Hall, The Assembly Brothers, address this question.
Board Talk

What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk

Understanding PCB Design Variables That Contribute to Warpage
Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Analysis Lab

How to Reduce Voiding on QFN Components
How to Reduce Voiding on QFN Components
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be?
Board Talk

Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this.
Board Talk

Methods to Get Volatile Compounds Out of Reflow Process
Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Analysis Lab

Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified?
Board Talk

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