Electronics Assembly Knowledge, Vision & Wisdom
Reflow Soldering, Profiling
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These programs cover reflow soldering, profiling, data collection and more. Programs are sorted by published date, most recent first.


Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk

Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting.
Board Talk

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Analysis Lab

Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk

How Frequently Should  We Recheck Profiles?
How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk

Void-Free Soldering With Vapor-Phase Vacuum Tech
Void-Free Soldering With Vapor-Phase Vacuum Tech
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology.
Production Floor

What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why?
Board Talk

How to Manage Material Outgassing in Reflow Oven
How to Manage Material Outgassing in Reflow Oven
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared.
Analysis Lab

How to Reduce Voiding on QFN Components
How to Reduce Voiding on QFN Components
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be?
Board Talk

Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this.
Board Talk

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