Electronics Assembly Knowledge, Vision & Wisdom
Reflow Soldering, Profiling << Page 1 of 9 >>
These programs cover reflow soldering, profiling, data collection and more.

Programs are sorted by published date, most recent first.
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5 vs 8-Zone Ovens
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer to purchase a 5-zone oven but our concern is that five zones may not be enough to ensure a reliable reflow process compared to an 8-zone oven. Jim Hall and Phil Zarrow, The Assembly Brothers, share their insight.
Board Talk
Ask the Experts
QFN Open Solder Joints
We are experiencing opens on assembled QFN components at a rate of approx 9%. Usually only 1 or 2 pads have opens. What is happening?
Ask the Experts
Ask the Experts
Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our PCB's after reflow. We tried everything but nothing yet has resolved the issue.
Ask the Experts
Ask the Experts
BGA BAll Sheer Testing
We soldered a lead-free BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. What should we expect?
Ask the Experts
Methods to Get Volatile Compounds Out of Reflow Process
Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor
Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk
Vapor Phase Quality Improvement
Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor
Evaluating Accuracy of Thermocouple Attach Methods
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
Analysis Lab
Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting.
Board Talk
Ask the Experts
Rechecking Thermal Profiles
Must wee replicate the thermal profiling process during long term mass production? How frequently do we need to recheck the reflow oven profiles?
Ask the Experts
Reflow Soldering, Profiling << Page 1 of 9 >>