Electronics Assembly Knowledge, Vision & Wisdom
Reflow Soldering, Profiling
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These programs cover reflow soldering, profiling, data collection and more. Programs are sorted by published date, most recent first.


Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this.
Board Talk

Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified?
Board Talk

5 vs 8-Zone Ovens
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer to purchase a 5-zone oven but our concern is that five zones may not be enough to ensure a reliable reflow process compared to an 8-zone oven. Jim Hall and Phil Zarrow, The Assembly Brothers, share their insight.
Board Talk

Methods to Get Volatile Compounds Out of Reflow Process
Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor

Vapor Phase Quality Improvement
Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor

Understanding PCB Design Variables That Contribute to Warpage
Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Analysis Lab

Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk

Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting.
Board Talk

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Analysis Lab

Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk

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