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Reflow Soldering, Profiling | ||||||||||
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology. Production Floor We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure? Board Talk With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. Board Talk To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? Board Talk The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk |
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