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| Reflow Soldering, Profiling | ||||||||||
| These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints. Analysis Lab
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? Board Talk
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their recommendations. Board Talk
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology. Production Floor
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure? Board Talk
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. Board Talk
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk |
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