Electronics Assembly Knowledge, Vision & Wisdom
Reflow Soldering, Profiling << Page 1 of 9 >>
These programs cover reflow soldering, profiling, data collection and more.

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Rechecking Thermal Profiles
Must wee replicate the thermal profiling process during long term mass production? How frequently do we need to recheck the reflow oven profiles?
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Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk
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A Generic Reflow Profile
We have a wide mix of PCB assembly types. Some propose we use the same reflow profile regardless of the PCB thickness, thermal mass or component mix.
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What Causes Component Rotation During Reflow?
We are using a large 2 pin SMT inductor. During reflow soldering it rotates almost 30 degree. Why is this component rotating during reflow?
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Double Reflow-Induced Brittle Interfacial Failures
Double Reflow-Induced Brittle Interfacial Failures
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints.
Analysis Lab
How Frequently Should  We Recheck Profiles?
How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk
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Profiling for Double Sided BGA
We are about to produce double sided BGA boards. What advice would you give for profiling? What advice would you give for reworking?
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Through Hole Connector Solder Joint Hole Fill
Looking at IPC-610D in relation to through hole connectors and Class III level soldering. What is the recommended inspection method to for 75% fill?
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Suggested Limit for PCBA Heat Cycles
What is the limit for heating cycles on one PCB assembly? Our PCBs contain BGAs, leadless components and large fine pitch components.
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Ask the Experts
Components Jumping Around During Reflow
We reflowed boards using a lead-free solder process and had components jumping around from their initial position. What could be causing this?
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Reflow Soldering, Profiling << Page 1 of 9 >>