Electronics Assembly Knowledge, Vision & Wisdom
Production Floor
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Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more. Programs are sorted by published date, most recent first.


Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor

An Introduction to the Process of Printed Electronics
An Introduction to the Process of Printed Electronics
While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Production Floor

Rework Challenges for Leading Edge Components BGA, QFN and LED
Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor

Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
PCB manufacturers need another additional processing step to chemically etch the deposit until they reach a planer surface to build the next layer without issues.
Production Floor

Leadless Flip Chip PLGA for Networking Applications
Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor

Enabling High-Speed Printing Using Low Cost Materials
Enabling High-Speed Printing Using Low Cost Materials
Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance.
Production Floor

Rework of High I/O Column Grid Arrays
Rework of High I/O Column Grid Arrays
Off-the-shelf column grid arrays are now being considered for use in a number of NASA systems. This paper presents rework and re-column attachment data.
Production Floor

Control of the Underfill of Surface Mount Assemblies
Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor

Vapor Phase Quality Improvement
Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor

Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

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