Electronics Assembly Knowledge, Vision & Wisdom
Production Floor
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Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more. Programs are sorted by published date, most recent first.


High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor

Selecting Stencil Technologies to Optimize Print Performance
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Production Floor

Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor

Process Control and Reliability of Reworked BGA Solder Joint
Process Control and Reliability of Reworked BGA Solder Joint
This paper discusses the work done in identifying the key features for the right BGA rework equipment.
Production Floor

Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Production Floor

Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor

Use of High Purity Water to Eliminate Contamination  And Achieve Cleanliness
Use of High Purity Water to Eliminate Contamination And Achieve Cleanliness
This paper discusses how high purity DI water can be produced at lower costs using a DI recycling approach in PCB production.
Production Floor

Industry 4.0 for Inspection in the Electronics Industry
Industry 4.0 for Inspection in the Electronics Industry
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Production Floor

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