Electronics Assembly Knowledge, Vision & Wisdom
Production Floor
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Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more. Programs are sorted by published date, most recent first.


Testing of Soldering Materials vs. Soldering Processes
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
Production Floor

The Development of a 0.3 mm Pitch CSP Assembly Process
The Development of a 0.3 mm Pitch CSP Assembly Process
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components.
Production Floor

Computed Tomography on Electronic Components
Computed Tomography on Electronic Components
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set.
Production Floor

Low Cost and High Pin Count Wafer Level Packaging
Low Cost and High Pin Count Wafer Level Packaging
Reliability improvement at low cost is achieved using plastic core balls at selected ball locations. A daisy chain WLP is the test vehicle.
Production Floor

Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Embedded Components from Concept-To-Manufacturing
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor

Reducing Dust Deposition on Electronic Equipment
Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor

Printed Electronics for Medical Devices
Printed Electronics for Medical Devices
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality.
Production Floor

Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor

Is Cleaning Critical to POP Assemblies?
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
Production Floor

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