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This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature). Production Floor
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive. Production Floor
This paper presents performance/process capability of various low/no silver alloy solder pastes. Production Floor
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location. Production Floor
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process. Production Floor
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation. Production Floor
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed. Production Floor
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements. Production Floor
This paper reviews soldering applications associated with cable assembly, including process modification and qualification with lead free solders. Production Floor |
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