Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 28 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
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Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor
Double Print Stencils Systems
Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor
Panel Level Packaging
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor
How To Eliminate PCB Bow and Twist
How To Eliminate PCB Bow and Twist
Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of circuit board bow and twist.
Production Floor
Assembly of POP with Novel Epoxy Flux on Solder Paste
Assembly of POP with Novel Epoxy Flux on Solder Paste
In this paper, a newly developed epoxy flux, that is compatible with solder paste, was evaluated for assembly and reliability.
Production Floor
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor
Enclosed Media Printing as an Alternative to Metal Blades
Enclosed Media Printing as an Alternative to Metal Blades
This paper explores the latest developments in enclosed media print head technology and how it can impact the bottom line.
Production Floor
Big Ideas on Miniaturization
Big Ideas on Miniaturization
This paper will investigate the impact of miniaturisation and heterogeneous assembly on the print process and strategies to keep one generation ahead.
Production Floor
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Paper presents performance of the profiled squeegee blade developed to create a multi-angle of attack for process control for all types of stencil printing processes.
Production Floor
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics any conformal coating removal solution needs to provide even finer cut resolutions, witout compromising quality, cost, and throughput.
Production Floor
Production Floor << Page 1 of 28 >>