Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 27 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
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Influence of PCB Surface Features on BGA Assembly Yield
Influence of PCB Surface Features on BGA Assembly Yield
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact.
Production Floor
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor
The Challenges of LGA Server Socket Trends
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor
3D Assembly Processes a Look at Today and Tomorrow
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor
Selecting Stencil Technologies to Optimize Print Performance
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
Production Floor << Page 1 of 27 >>