Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 26 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
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Wearable Electronics & Big Data = High Volume, High Mix SMT
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
Investigation into Lead-Free Low Silver Solder Wire for Electronics
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Fill the Void II: An Investigation into Methods of Reducing Voiding
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
One Big Cause of Assembly Problems
One Big Cause of Assembly Problems
Up to 75% of assembly problems stem from paste printing. This report reveals variability in aperture size between various stencil manufacturers.
Production Floor
Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Coreless Package Substrate Issues and Challenges
Coreless Package Substrate Issues and Challenges
This paper addresses the major challenges of reducing coreless substrate warpage in terms of both substrate manufacturing and assembly process.
Production Floor
Hand Printing using Nanocoated and other High End Stencil Materials
Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, certain high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor
BGA Re-balling from Lead-free to Tin-lead
BGA Re-balling from Lead-free to Tin-lead
This paper includes an assessment of the mechanical integrity of commercially available BGAs after reballing.
Production Floor
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Selective Soldering for Interconnection Technology
Selective Soldering for Interconnection Technology
Paper evaluates three processes for selective surface mount soldering. A Xenon Lamp-based system, a hot air system, and a reflow oven system.
Production Floor
Production Floor << Page 1 of 26 >>