Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 26 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor
Assembly Options for Handheld Products
Assembly Options for Handheld Products
Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible.
Production Floor
Applying Lean Philosophies to Supply Chain Management in EMS
Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
Production Floor
CGA Trends and Capabilities
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor
Problems to Look for with Crimp Terminations
Problems to Look for with Crimp Terminations
Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory's Process Defect Database.
Production Floor
Electronics Manufacturing by Inkjet Printing
Electronics Manufacturing by Inkjet Printing
Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for physical tooling.
Production Floor
Reflow Problems on Intrusive Solder Joints
Reflow Problems on Intrusive Solder Joints
Problems with incomplete reflow on "intrusive" solder joints, 90% of the time is a faulty profile is the culprit. Why?
Production Floor
Evaluation of Stencil Materials, Suppliers and Coatings
Evaluation of Stencil Materials, Suppliers and Coatings
An experiment is devised to identify the best stencil option for a highly miniaturized, densely populated SMT product.
Production Floor
Defluxing for New Assembly Requirements
Defluxing for New Assembly Requirements
This paper covers selecting the most effective, rugged defluxing option relative to the circuit board assembly design.
Production Floor
The Effects of Phosphorus in Lead-Free Solders
The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.
Production Floor
Production Floor << Page 1 of 26 >>
 
 
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication