Electronics Assembly Knowledge, Vision & Wisdom
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Production Floor << Page 1 of 24 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

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Optimization of Stencil Apertures to Compensate for Scooping
Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Production Floor
A Robust Fine Feature Printing Process
A Robust Fine Feature Printing Process
This paper evaluates many fine printing stencil factors that have an increased effect on the transfer efficiency of solder pastes.
Production Floor
Lead-Free Flux and Influence on Cleaning
Lead-Free Flux and Influence on Cleaning
Lead-free flux technology is more difficult to clean. Cleaners with a better matching solvency for the residues are needed.
Production Floor
Risk Mitigation in Hand Soldering
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Cost Comparison of Complex PCB Fabrication
Cost Comparison of Complex PCB Fabrication
The authors present an alternative to sequential lamination for fabricating complex PCBs, where conductive paste is used as interconnect between cores.
Production Floor
Voiding Control On Bottom Terminated Components Using Preforms
Voiding Control On Bottom Terminated Components Using Preforms
This paper looks at a new approach using readily available solder fortification preforms.
Production Floor
Fill the Void II: An Investigation into Methods of Reducing Voiding
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Investigation into Lead-Free Low Silver Solder Wire for Electronics
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Wearable Electronics & Big Data = High Volume, High Mix SMT
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
Coreless Package Substrate Issues and Challenges
Coreless Package Substrate Issues and Challenges
This paper addresses the major challenges of reducing coreless substrate warpage in terms of both substrate manufacturing and assembly process.
Production Floor
Production Floor << Page 1 of 24 >>