Electronics Assembly Knowledge, Vision & Wisdom
Production Floor
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Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more. Programs are sorted by published date, most recent first.


Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor

Assembly Process Feasibility of Low Silver Solder Paste
Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy solder pastes.
Production Floor

Engineered Tin-Copper Alloys in Selective Soldering
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

A New Line Balancing Method
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor

Design for Testability to Overcome Functional Board Test Complexities
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Production Floor

Electroplating of Cu in TSV
Electroplating of Cu in TSV
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Production Floor

Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed.
Production Floor

Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Production Floor

The Dynamics of Low Stress Epoxy Curing
The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

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