Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 29 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
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Electronic Packages and Modules Based on Embedded Die Technologies
Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor
Evaluating Manual and Automated Heat Sink Assembly
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented.
Production Floor
Rigid-Flex PCB Right the First Time - Without Paper Dolls
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Process Control and Reliability of Reworked BGAs
Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor
Evaluation of Stencil Technology for Miniaturization
Evaluation of Stencil Technology for Miniaturization
The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition.
Production Floor
Methods to Get Volatile Compounds Out of Reflow Process
Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor
Returning to Basics in the SMT Screen Printing Process
Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor
Production Floor << Page 1 of 29 >>