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Production Floor << Page 1 of 23 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

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Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Dead bugging is when you add components to a circuit board upside-down and run jumper wires to complete the circuits. Here's an alternative.
Production Floor
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Beyond 0402M Placement: Considerations for Microchip Mounting
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor
Results with Benchtop PCB Cleaning
Results with Benchtop PCB Cleaning
This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process.
Production Floor
Soldering Improvement for SMT Connectors
Soldering Improvement for SMT Connectors
This paper covers experiments for improving the SMT process for a few types of difficult to solder surface mount connectors.
Production Floor
Vapour Phase - Profiling for Lead-Free Alloys
Vapour Phase - Profiling for Lead-Free Alloys
This paper covers the profiling gap with thermal control techniques to address profiles meeting paste manufacturer recommendations.
Production Floor
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Condensation Testing - A New Approach
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor
Implementing Robust Bead Probe Test Processes
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor
Why Switch From Pure DI-Water to Chemistry
Why Switch From Pure DI-Water to Chemistry
The purpose of this paper is to report a timely direct comparison between a pure DI-water process and a chemically assisted application.
Production Floor
Production Floor << Page 1 of 23 >>