Electronics Assembly Knowledge, Vision & Wisdom
Production Floor << Page 1 of 29 >>
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.

Programs are sorted by published date, most recent first.
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Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Beyond 0402M Placement: Considerations for Microchip Mounting
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor
Condensation Testing - A New Approach
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor
Converting Cable Assembly to Lead Free Solder
Converting Cable Assembly to Lead Free Solder
This paper reviews soldering applications associated with cable assembly. The focus is on process modification and qualification with lead free solders.
Production Floor
Solder Paste Stencil Design for Optimal QFN Reliability
Solder Paste Stencil Design for Optimal QFN Reliability
In this study, the volume of solder used in assembly of QFNs was varied to investigate the relationship between standoff height and thermal cycle life.
Production Floor
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
Investigation into Printing Miniaturized Devices
Investigation into Printing Miniaturized Devices
Paper investigates a solution to ensure a high yield process where fine pitch devices can be printed alongside traditional larger footprint devices.
Production Floor
Challenges of Manufacturing with Printed Circuit Board Cavities
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity design and assembly issues identified during the design of experiments, the findings, reliability results, and conclusions are discussed in this paper.
Production Floor
Industry Progress from 2005 to Present Day
Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor
Production Floor << Page 1 of 29 >>