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These programs cover overall operations, plan productivity, issues with the supply chain and more. Programs are sorted by published date, most recent first.
Cost Comparison of Complex PCB Fabrication
The authors present an alternative to sequential lamination for fabricating complex PCBs, where conductive paste is used as interconnect between cores.
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
A Review of Industry Terminology and Acronyms
What does the term BTC refer to? The Assembly Brothers talk about uniformity of terminology and the industry's acronyms.
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Long Term Component Storage
We need to store SMD components for at least 10 years. What do you recommend for a humidity and temperature settings?
Concentration Monitoring & Closed Loop Control
In this study, the Flowsensor or acoustic concentration measurement system was evaluated at the original beta site detailing 20 days of concentration monitoring data.
Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
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