Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors
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These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. Programs are sorted by published date, most recent first.


Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Advance Board Level Modeling Wafer Level Packages
Advance Board Level Modeling Wafer Level Packages
In this paper it is determined that the effective flexural modulus depends on the stackup and it often does not correlate with the effective tensile modulus.
Analysis Lab

3D Integration a Thermal-Electrical-Mechanical-Reliability Study
3D Integration a Thermal-Electrical-Mechanical-Reliability Study
In this paper examples of electro and thermomigration effects as a failure mechanism in PoP-BGA, CuSn pillars, flip chip and TSV were presented.
Analysis Lab

Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech

BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech

Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Fluxless Die Attach by Activated Forming Gas
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor

Panel Level Packaging
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor

Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech

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