Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor

Single Device Traceability in Assembly without ECID
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab

Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech

BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech

Innovative Panel Plating for Heterogeneous Integration
Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

CGA Trends and Capabilities
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor

Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech