Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Programs are sorted by published date, most recent first.
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Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech
Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech
Leadless Flip Chip PLGA for Networking Applications
Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor
New Approaches to Develop a Scalable 3D IC Assembly Method
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor
Flip Chip LED Solder Assembly
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor
3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor
Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab
Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>