Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors << Page 1 of 5 >>
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Programs are sorted by published date, most recent first.
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Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech
Material Selection for Reliable TMV Pop Assembly
Material Selection for Reliable TMV Pop Assembly
This paper investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly.
Materials Tech
Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech
Status and Outlooks of Flip Chip Technology
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Materials Tech
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech
No-Clean Flux Residue and Underfill Compatibility
No-Clean Flux Residue and Underfill Compatibility
This paper covers an experiment designed to measure the electrical reliability of various combinations of underfill and no-clean flux residues.
Materials Tech
Evaluation of POP Assembly Under Load
Evaluation of POP Assembly Under Load
Study evaluates one pass and two pass techniques for assembly of POP devices under torsion loading to compare impact on the fatigue durability.
Production Floor
Challenges of Package on Package Devices
Challenges of Package on Package Devices
Processes associated with soldering stacked packages using dip flux and dip solder paste are investigated.
Materials Tech
Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor
Embedded Packaging Technologies
Embedded Packaging Technologies
Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Materials Tech
Flip-Chip, MEMS, Semiconductors << Page 1 of 5 >>