Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Programs are sorted by published date, most recent first.
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Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor
Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech
Material Selection for Reliable TMV Pop Assembly
Material Selection for Reliable TMV Pop Assembly
This paper investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly.
Materials Tech
Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor
Status and Outlooks of Flip Chip Technology
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Materials Tech
Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>