Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Programs are sorted by published date, most recent first.
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Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Production Floor
Leadless Flip Chip PLGA for Networking Applications
Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has evolved and expanded across numerous applications.
Production Floor
New Approaches to Develop a Scalable 3D IC Assembly Method
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor
3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor
Flip Chip LED Solder Assembly
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor
Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech
3D Integration a Thermal-Electrical-Mechanical-Reliability Study
3D Integration a Thermal-Electrical-Mechanical-Reliability Study
In this paper examples of electro and thermomigration effects as a failure mechanism in PoP-BGA, CuSn pillars, flip chip and TSV were presented.
Analysis Lab
Flip-Chip, MEMS, Semiconductors << Page 1 of 6 >>