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Flip-Chip, MEMS, Semiconductors | ||||||||||
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. | ||||||||||
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Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly. Analysis Lab Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication. Production Floor The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices. Analysis Lab This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components. Materials Tech The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers. Materials Tech This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology. Materials Tech This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs. Production Floor The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment. Materials Tech |
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