Flip-Chip, MEMS, Semiconductors



These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab

Innovative Panel Plating for Heterogeneous Integration
Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

Single Device Traceability in Assembly without ECID
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab

CGA Trends and Capabilities
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor

Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Fluxless Die Attach by Activated Forming Gas
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor

Panel Level Packaging
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor

Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

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