Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors << Page 1 of 5 >>
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

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Evaluation of POP Assembly Under Load
Evaluation of POP Assembly Under Load
Study evaluates one pass and two pass techniques for assembly of POP devices under torsion loading to compare impact on the fatigue durability.
Production Floor
Challenges of Package on Package Devices
Challenges of Package on Package Devices
Processes associated with soldering stacked packages using dip flux and dip solder paste are investigated.
Materials Tech
Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor
Embedded Packaging Technologies
Embedded Packaging Technologies
Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Materials Tech
Fluxless Die Attach by Activated Forming Gas
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor
Panel Level Packaging
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor
Design for Flip-Chip and Chip-Size Technology
Design for Flip-Chip and Chip-Size Technology
This paper provides a comparison of flip-chip and wafer level array package methodologies detailed in IPC-7094.
Materials Tech
Solder Bumping for Flip Chip Technology
Solder Bumping for Flip Chip Technology
Paper presents new cost-efficient solder bumping and adapted assembly technologies for processing flip-chips.
Materials Tech
Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
Flip-Chip, MEMS, Semiconductors << Page 1 of 5 >>
 
 
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