Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors
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These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. Programs are sorted by published date, most recent first.


3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor

Flip Chip LED Solder Assembly
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor

Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor

Silicon V-Groove Alignment Bench for Optical Component Assembly
Silicon V-Groove Alignment Bench for Optical Component Assembly
In this paper, a Silicon Interposer is described that provides electrical interconnects to an edge emitting laser die and a laser monitor detector die.
Analysis Lab

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor

Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Advance Board Level Modeling Wafer Level Packages
Advance Board Level Modeling Wafer Level Packages
In this paper it is determined that the effective flexural modulus depends on the stackup and it often does not correlate with the effective tensile modulus.
Analysis Lab

3D Integration a Thermal-Electrical-Mechanical-Reliability Study
3D Integration a Thermal-Electrical-Mechanical-Reliability Study
In this paper examples of electro and thermomigration effects as a failure mechanism in PoP-BGA, CuSn pillars, flip chip and TSV were presented.
Analysis Lab

Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech

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