Electronics Assembly Knowledge, Vision & Wisdom
Flip-Chip, MEMS, Semiconductors
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These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. Programs are sorted by published date, most recent first.


Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab

Flip Chip LED Solder Assembly
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor

3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor

Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor

Status and Outlooks of Flip Chip Technology
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Materials Tech

Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor

Advance Board Level Modeling Wafer Level Packages
Advance Board Level Modeling Wafer Level Packages
In this paper it is determined that the effective flexural modulus depends on the stackup and it often does not correlate with the effective tensile modulus.
Analysis Lab

3D Integration a Thermal-Electrical-Mechanical-Reliability Study
3D Integration a Thermal-Electrical-Mechanical-Reliability Study
In this paper examples of electro and thermomigration effects as a failure mechanism in PoP-BGA, CuSn pillars, flip chip and TSV were presented.
Analysis Lab

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