Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 14 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Electroplated Copper Filling of Through Holes
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
3D Printed Electronics for Printed Circuit Structures
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Analysis Lab
Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech
Rigid-Flex PCB Right the First Time - Without Paper Dolls
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Big Problems with HASL Finish
Big Problems with HASL Finish
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, but the PCB was manufactured using tin lead HASL finish.
Board Talk
Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech
Flexible Circuit Materials for High Temperature Applications
Flexible Circuit Materials for High Temperature Applications
This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications.
Materials Tech
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. If we eliminate the gluing of the MELF components there is no misalignment.
Ask the Experts
Evaluation of the Use of ENEPIG in Small Solder Joints
Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Analysis Lab
PC Fab, Board Design, Laminates << Page 1 of 14 >>