PC Fab, Board Design, Laminates



These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Embedded Components from Concept-To-Manufacturing
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor

Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech

Method to Measure Intermetallic Layer Thickness
Method to Measure Intermetallic Layer Thickness
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed.
Analysis Lab

RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech

Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech

Improving Density in Microwave Multilayer PCBs
Improving Density in Microwave Multilayer PCBs
Paper presents work performed to achieve LCP-based high density multilayer structures, describing the breadboards manufactured and tested.
Analysis Lab

Flexible Circuit Materials for High Temperature Applications
Flexible Circuit Materials for High Temperature Applications
This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications.
Materials Tech

The Effects of PCB Fabrication on High-Frequency Electrical Performance
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices.
Materials Tech

NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab

Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech

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