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PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Ask the Experts
HASL vs. Immersion Gold
For electronic equipment used in corrosive environments hot air solder leveling is suggested as a finish instead of immersion gold. Suggestions?
Ask the Experts
Failure Mechanism in Embedded Capacitors
Failure Mechanism in Embedded Capacitors
Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric.
Analysis Lab
3D Printed Electronics for Printed Circuit Structures
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Analysis Lab
Printable Materials for Electronic Packaging
Printable Materials for Electronic Packaging
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Materials Tech
Effect of Lead-Free on Key Material Properties
Effect of Lead-Free on Key Material Properties
Paper includes study of 14 laminate materials to assess the effects of lead free soldering on various properties.
Materials Tech
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab
Inkjet Printing for Electronic Circuits
Inkjet Printing for Electronic Circuits
This paper explores the promise of what inkjet printing can bring to process simplification, cost reduction and improved capabilities.
Production Floor
The Universal PCB Design Grid System
The Universal PCB Design Grid System
Paper reviews reviews one of the single most important aspects of the electronics industry - The PCB Design Grid System.
Materials Tech
Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Embedded Components from Concept-To-Manufacturing
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor
PC Fab, Board Design, Laminates << Page 1 of 13 >>