Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates
Previous   Page 1 of 13   Next


These programs cover bare PC board fabrication, circuit board design, laminates and more. Programs are sorted by published date, most recent first.


Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech

Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor

RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech

Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech

Evaluation of the Use of ENEPIG in Small Solder Joints
Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Analysis Lab

Direct Determination of Phosphorus Content in Electroless Nickel Plating
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab

Flexible Circuit Materials for High Temperature Applications
Flexible Circuit Materials for High Temperature Applications
This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications.
Materials Tech

Microstructure and Performance of Micro CU Pillars Assemblies
Microstructure and Performance of Micro CU Pillars Assemblies
Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times.
Analysis Lab

The Impact of VIA and Pad Design on QFN Assembly
The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab

Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice?
Board Talk

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search