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PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
New Phosphorus-based Curing Agents for PWB
New Phosphorus-based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials.
Materials Tech
Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech
Printed Circuit Structures, the Evolution of Printed Circuit Boards
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech
Insertion Loss Comparisons of High Frequency PCBs
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
Coreless Package Substrate Issues and Challenges
Coreless Package Substrate Issues and Challenges
This paper addresses the major challenges of reducing coreless substrate warpage in terms of both substrate manufacturing and assembly process.
Production Floor
Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Improve Etching Performance
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Materials Tech
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
PC Fab, Board Design, Laminates << Page 1 of 13 >>