Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Lead-free Board Materials Reliability Project
Lead-free Board Materials Reliability Project
Paper covers results from 20 laminate materials. Relationship between moisture uptake and material survivability reflow is discussed.
Materials Tech
How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help.
Board Talk
Predictability for PCB Layout Density
Predictability for PCB Layout Density
This paper covers the use of a new tool called a "Predictability Calculator" to predict PCB layout density.
Materials Tech
Best Practices for Controlling Moisture in PCBs
Best Practices for Controlling Moisture in PCBs
Paper provides info of moisture diffusion processes, governing models, and dependent variables.
Materials Tech
NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab
A New PCB Surface Finish
A New PCB Surface Finish
Paper covers a new PCB surface finish that offers outstanding performance and excellent environmental protection.
Materials Tech
Connector Design for Wearables
Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech
Semi-Additive Process for High Frequency Signal Substrates
Semi-Additive Process for High Frequency Signal Substrates
This paper covers a new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions.
Materials Tech
Halogen-Free Material for High Speed PCBs
Halogen-Free Material for High Speed PCBs
A novel halogen free material for PCB's has been developed. The material has many improved properties over conventional FR-4.
Materials Tech
Effects of Solder Mask on Electro-Migration
Effects of Solder Mask on Electro-Migration
Paper presents results of temperature, humidity, bias testing for comparative evaluation of ECM on circuit boards with and without a solder mask.
Materials Tech
PC Fab, Board Design, Laminates << Page 1 of 13 >>
 
 
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