Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Embedded Passive Technology
Embedded Passive Technology
This paper summarizes the selection of resistor embedded materials, evaluations of resistive material and duplication of a complex digital design.
Materials Tech
Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Side Wall Wetting Induced Void Formation
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
Coreless Package Substrate Issues and Challenges
Coreless Package Substrate Issues and Challenges
This paper addresses the major challenges of reducing coreless substrate warpage in terms of both substrate manufacturing and assembly process.
Production Floor
Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
CVS Control of Via Fill Acid Copper Electroplating Baths
CVS Control of Via Fill Acid Copper Electroplating Baths
This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths.
Analysis Lab
Embedded Components: Analysis of Reliability
Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components compared to that of standard SMT components.
Analysis Lab
Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech
Influence of Plating Quality on Reliability of Microvias
Influence of Plating Quality on Reliability of Microvias
This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Analysis Lab
PC Fab, Board Design, Laminates << Page 1 of 13 >>