Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 14 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech
Demise of the Plated-Through Hole?
Demise of the Plated-Through Hole?
How long do you expect the industry will continue to use through hole components? I can envision connectors being used for some time, what about component types?
Board Talk
BGA Components and Coplanarity
BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk
Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech
Via Filling: Challenges in the Plating Process
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor
Plasma Polymerization
Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
Room Temperature Fast Flow Reworkable Underfill for LGA
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab
Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech
New Phosphorus-based Curing Agents for PWB
New Phosphorus-based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials.
Materials Tech
PC Fab, Board Design, Laminates << Page 1 of 14 >>