Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates
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These programs cover bare PC board fabrication, circuit board design, laminates and more. Programs are sorted by published date, most recent first.


Use of High Purity Water to Eliminate Contamination  And Achieve Cleanliness
Use of High Purity Water to Eliminate Contamination And Achieve Cleanliness
This paper discusses how high purity DI water can be produced at lower costs using a DI recycling approach in PCB production.
Production Floor

Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech

How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their own experiences.
Board Talk

Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech

What is Causing Dimples in Blind Via Pads?
What is Causing Dimples in Blind Via Pads?
Recently we encountered defects on some bare boards from our supplier. The defect is a small dimple. What might be the cause of this defect?
Board Talk

Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech

Big Problems with HASL Finish
Big Problems with HASL Finish
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, but the PCB was manufactured using tin lead HASL finish. Jim Hall and Phil Zarrow, the Assembly Brothers discuss this.
Board Talk

Room Temperature Fast Flow Reworkable Underfill for LGA
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab

New Phosphorus-based Curing Agents for PWB
New Phosphorus-based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials.
Materials Tech

Printed Circuit Structures, the Evolution of Printed Circuit Boards
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech

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