Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 15 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Young Laplace Equation Reveals New Possibilities Thermal Pad Design
Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Production Floor
Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech
New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech
Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice?
Board Talk
Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. If we eliminate the gluing of the MELF components there is no misalignment.
Ask the Experts
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface.
Analysis Lab
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Connector Design for Wearables
Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech
Semi-Additive Process for High Frequency Signal Substrates
Semi-Additive Process for High Frequency Signal Substrates
This paper covers a new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions.
Materials Tech
PC Fab, Board Design, Laminates << Page 1 of 15 >>