Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Hot Air Solder Leveling in the Lead-free Era
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected with a properly applied HASL finish.
Materials Tech
Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4?
Board Talk
Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Can you point us to a guideline with the recommended through hole component to hole diameter ratio? What can be do to improve barrel fill?
Board Talk
When Precision is Not Good Enough
When Precision is Not Good Enough
Papers shows that variations in pcb design cannot be accounted for by look up tables and a more complex model is required.
Materials Tech
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
Ask the Experts
Calculating PCB Hole Diameters
Our bare boards are typically .065" thick. How can we calculate the hole diameter for connector pins if the board thickness increases to .150"?
Ask the Experts
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech
Manufacture of Aluminum Substrate PCBs
Manufacture of Aluminum Substrate PCBs
A new fab method that uses an aluminum substrates that house fully tested and burned in components to create a component board is described.
Materials Tech
New Developments in PCB Laminates
New Developments in PCB Laminates
This paper outlines developments for halogen free laminate systems to reduce thermal stability struggles and poor electrical performance.
Materials Tech
Nanotechnology for Lead-free Final Finishes
Nanotechnology for Lead-free Final Finishes
Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability.
Materials Tech
PC Fab, Board Design, Laminates << Page 1 of 13 >>
 
 
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