Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates
Previous   Page 1 of 13   Next


These programs cover bare PC board fabrication, circuit board design, laminates and more. Programs are sorted by published date, most recent first.


Dielectrics for Embedding Active and Passive Components
Dielectrics for Embedding Active and Passive Components
This paper presents a composite type material that can be used as dielectric for the embedding of actives and passives.
Materials Tech

Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech

Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech

NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab

Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech

HDI Structures Using Thin Films and Low Temp Paste
HDI Structures Using Thin Films and Low Temp Paste
Conductors and dielectrics have to be considered when building any layer HDI. New methods and materials are becoming available for building HDI.
Materials Tech

Manufacture of Aluminum Substrate PCBs
Manufacture of Aluminum Substrate PCBs
A new fab method that uses an aluminum substrates that house fully tested and burned in components to create a component board is described.
Materials Tech

Electroplated Copper Filling of Through Holes
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor

High Reliability, Stress-free Copper Deposit
High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech

Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface.
Analysis Lab

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search