Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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Characterization of PCB Material & Manufacturing for High Frequency
Characterization of PCB Material & Manufacturing for High Frequency
This paper investigates the impact of different PCB manufacturing technologies and their relation to their high frequency behavior.
Analysis Lab
Connector Design for Wearables
Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech
Semi-Additive Process for High Frequency Signal Substrates
Semi-Additive Process for High Frequency Signal Substrates
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered.
Materials Tech
Side Wall Wetting Induced Void Formation
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
CVS Control of Via Fill Acid Copper Electroplating Baths
CVS Control of Via Fill Acid Copper Electroplating Baths
This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths.
Analysis Lab
Dielectrics for Embedding Active and Passive Components
Dielectrics for Embedding Active and Passive Components
This paper presents a composite type material that can be used as dielectric for the embedding of actives and passives.
Materials Tech
Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech
Via Filling: Challenges in the Plating Process
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor
Plasma Polymerization
Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
PC Fab, Board Design, Laminates << Page 1 of 13 >>