Electronics Assembly Knowledge, Vision & Wisdom
PC Fab, Board Design, Laminates << Page 1 of 13 >>
These programs cover bare PC board fabrication, circuit board design, laminates and more.

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What Are the Benefits and Drawbacks of OSP Finish?
What Are the Benefits and Drawbacks of OSP Finish?
What are the advantages of using an OSP surface finish? What precautions should be taken when using circuit boards supplied with OSP finish?
Board Talk
Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage current within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
The Effect of Radiation Losses on High Frequency PCB Performance
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper presented in 2013 that addressed microwave insertion loss of common PCB transmission line circuits.
Analysis Lab
Board Performance after Pb-Free Reflow
Board Performance after Pb-Free Reflow
This paper will focus on air-air thermal cycling, IST testing and material survivability after lead-free assembly reflow.
Materials Tech
Emerging Substrate Technologies
Emerging Substrate Technologies
This paper outlines the market dynamics driving the development of advanced substrates in today's industry landscape.
Materials Tech
Reliability Performance of Very Thin Boards
Reliability Performance of Very Thin Boards
This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups.
Analysis Lab
Via Filling: Challenges in the Plating Process
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor
The Perfect Copper Surface
The Perfect Copper Surface
To provide the functionality in today's electronics, printed circuit boards are approaching the complexity of semiconductors.
Analysis Lab
Toughened Laminates for Circuit Boards
Toughened Laminates for Circuit Boards
Paper covers using pre-formed toughening materials in resin formulations.
Materials Tech
Plasma Polymerization
Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor
PC Fab, Board Design, Laminates << Page 1 of 13 >>
 
 
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