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PC Fab, Board Design, Laminates | ||||||||||
These programs cover bare PC board fabrication, circuit board design, laminates and more. | ||||||||||
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A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented. Materials Tech Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs. Production Floor Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases. Production Floor This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs. Production Floor This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows. Analysis Lab What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario. Board Talk Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface. Analysis Lab We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences. Board Talk Recently we encountered defects on some bare boards from our supplier. The defect is a small dimple. What might be the cause of this defect? Board Talk Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application. Materials Tech |
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