PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech

Influence of Copper Conductor Surface Treatment for High Frequency PCB
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor

Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor

Young Laplace Equation Reveals New Possibilities Thermal Pad Design
Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Production Floor

NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab

How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario.
Board Talk

Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface.
Analysis Lab

Big Problems with HASL Finish
Big Problems with HASL Finish
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences.
Board Talk

What is Causing Dimples in Blind Via Pads?
What is Causing Dimples in Blind Via Pads?
Recently we encountered defects on some bare boards from our supplier. The defect is a small dimple. What might be the cause of this defect?
Board Talk

Connector Design for Wearables
Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech