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What Causes Black Pad?
What is the primary cause of Black Pad and/or pad contamination during the assembly process?
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Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4 degree Celsius for more than 8 months. The shelf life is 6 months. Can it be used?
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Solder Paste Life on the Stencil
Our solder paste has a specified life on the stencil of 10 hours. After 10 hours of manufacturing, do we need to remove all the paste and scrap it?
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A Generic Reflow Profile
We have a wide mix of PCB assembly types. Some propose we use the same reflow profile regardless of the PCB thickness, thermal mass or component mix.
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Selective Printing for BGA Components
We use common BGA packages on many of our low-end products. To save cost, could we print paste only on the pads that have functional requirements?
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Solder Paste Alloy Check
We accidentally assembled boards using lead-free paste. Is there an easy method to check which paste has been used?
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Un-cleaned PCB Assemblies Potted
Our PCBs were soldered with a washable flux. The flux was not removed and the boards were potted with epoxy based resin. What can we expect?
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What Causes Component Rotation During Reflow?
We are using a large 2 pin SMT inductor. During reflow soldering it rotates almost 30 degree. Why is this component rotating during reflow?
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Toe Fillet Requirements on Gull Wing Components
Is a toe fillet required on gull wing components? We have some gull wing components that have no toe fillet, but all other requirements are met.
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Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
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Ask the Experts << Page 1 of 34 >>