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Stencil Cleaning Frequency
What is the industry standard for the amount of time between stencil cleaning?
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BGA BAll Sheer Testing
We soldered a lead-free BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. What should we expect?
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MSD Components Baked Too Long
If MSD components are baked for more time than specified in J Std, can this cause potential failures or other problems?
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Ask the Experts
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with cold solder joint on our wave soldering system. Could these be caused by using a selective soldering frame?
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Ask the Experts
What is the IPC Definition of Uncommonly Harsh?
IPC-A-610 defines class 3 to include products where "the end use environment may be uncommonly harsh." How is "uncommonly harsh" defined?
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Floor Life of MSD Parts
We put a new desiccant pack and new humidity indicator card in the MSD bag. If the humidity indicator card is not pink, do we need to bake the components?
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Estimating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part?
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Hot Air Solder 0201s and 01005s
We are struggling to solder and rework small parts - 0201s and 01005s. I have been using a small nozzle hot air solder rework station with adjustable air flow.
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Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
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QFN Test Failures Caused by Flux
A test engineer claims that test failures are due to flux residue between terminations that affects the capacitance at the joints. Is this a valid claim?
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Ask the Experts << Page 1 of 34 >>