Electronics Assembly Knowledge, Vision & Wisdom HOME PROGRAMS DIRECTORY SUBSCRIBE ARCHIVE/TRANSLATE Ask the Experts << Page 1 of 34 >> Arranged via association with Circuitnet.. See the Expert Panel | Submit A Questions | Join the Panel Programs are sorted by published date, most recent first. Directory Search         Program Search         Stencil Cleaning Frequency What is the industry standard for the amount of time between stencil cleaning? Ask the Experts BGA BAll Sheer Testing We soldered a lead-free BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. What should we expect? Ask the Experts MSD Components Baked Too Long If MSD components are baked for more time than specified in J Std, can this cause potential failures or other problems? Ask the Experts Selective Soldering Frame Causing Cold Solder Joints We have continual problems with cold solder joint on our wave soldering system. Could these be caused by using a selective soldering frame? Ask the Experts What is the IPC Definition of Uncommonly Harsh? IPC-A-610 defines class 3 to include products where "the end use environment may be uncommonly harsh." How is "uncommonly harsh" defined? Ask the Experts Floor Life of MSD Parts We put a new desiccant pack and new humidity indicator card in the MSD bag. If the humidity indicator card is not pink, do we need to bake the components? Ask the Experts Estimating Failure Rate During Rework Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part? Ask the Experts Hot Air Solder 0201s and 01005s We are struggling to solder and rework small parts - 0201s and 01005s. I have been using a small nozzle hot air solder rework station with adjustable air flow. Ask the Experts Test Probe Problems After Pin-In-Paste We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions? Ask the Experts QFN Test Failures Caused by Flux A test engineer claims that test failures are due to flux residue between terminations that affects the capacitance at the joints. Is this a valid claim? Ask the Experts Ask the Experts << Page 1 of 34 >> About | Advertising | Archives | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms | Translate Circuit Insight 6 Liberty Square #2040, Boston MA 02109 USA Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager Copyright © Circuitnet Media LLC. All rights reserved. A Circuitnet Media Publication