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QFN Open Solder Joints
We are experiencing opens on assembled QFN components at a rate of approx 9%. Usually only 1 or 2 pads have opens. What is happening?
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Ask the Experts
Stencil Cleaning Frequency
What is the industry standard for the amount of time between stencil cleaning?
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Ask the Experts
Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our PCB's after reflow. We tried everything but nothing yet has resolved the issue.
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Ask the Experts
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with cold solder joint on our wave soldering system. Could these be caused by using a selective soldering frame?
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Ask the Experts
MSD Components Baked Too Long
If MSD components are baked for more time than specified in J Std, can this cause potential failures or other problems?
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Customer Approval for Repairs
We have a case where a customer's board was repaired without authorization. Does IPC specify that customer approval is required for class 3 repairs?
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Ask the Experts
Floor Life of MSD Parts
We put a new desiccant pack and new humidity indicator card in the MSD bag. If the humidity indicator card is not pink, do we need to bake the components?
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Estimating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part?
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BGA BAll Sheer Testing
We soldered a lead-free BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. What should we expect?
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Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
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Ask the Experts << Page 1 of 34 >>