Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Programs are sorted by published date, most recent first.
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What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk
Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab
Surface Mount Warpage Case Study
Surface Mount Warpage Case Study
A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile.
Analysis Lab
Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab
Ask the Experts
LED Component Shift During Reflow
What can be the root cause of SMT LED Component Shift during reflow?
Ask the Experts
Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab
Ask the Experts
Contaminated Joints Cause an Assembly to Fail RoHS Compliance
Can a few contaminated solder joints cause an entire assembly to fail? Some of the joints were cross-contaminated with leaded solder.
Ask the Experts
Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor
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Dust contamination after selective soldering
We are using SN100C alloy and a no-clean flux applied with drop jet. The dross dust appears in the vicinity of solder joints, but not immediately adjacent.
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Contamination, Defects, Whiskers << Page 1 of 9 >>