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Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

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Eliminate Tin Whiskers on Component Leads
Eliminate Tin Whiskers on Component Leads
Is there a process that can be used to re-plate component leads to add lead to eliminate the problem of tin whisker formation?
Board Talk
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? The Assembly Brothers, Phil Zarrow and Jim Hall, offer their experience.
Board Talk
Ask the Experts
Insufficient Heel Fillets with PLCC J Lead Components
We have an insufficient solder joint heel fillet with a PLCC J lead component. Testing indicates we need additional solder at the heel joint.
Ask the Experts
Reducing Defects with Embedded Sensing
Reducing Defects with Embedded Sensing
This paper covers sensing technologies to guarantee that only good PCBs pass the assembly process, reducing rework and improving efficiency.
Materials Tech
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab
Head and Pillow SMT Failure Modes
Head and Pillow SMT Failure Modes
This paper describes critical factors affecting head and pillow and how to identify the root cause and give potential solutions to prevent the defect.
Analysis Lab
Intermittent Connector Failures
Intermittent Connector Failures
This paper discusses findings relating to the predominant failure mechanism for connectors, contact area corrosion.
Analysis Lab
Are Gloves Required for PCB Handling?
Are Gloves Required for PCB Handling?
How important are gloves when handling circuit boards prior to wave soldering or reflow soldering? The Assembly Brothers, Phll Zarrow and Jim Hall review the topic and provide insight.
Board Talk
Corrosion and Contaminant Diffusion Multi-Physics Model
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab
Ask the Experts
Contamination Using Solvent Dispensers
We use small bench-top solvent dispensers with acid brushes. Are we dragging contamination into the solvent dispenser when we replenish solvent?
Ask the Experts
Contamination, Defects, Whiskers << Page 1 of 9 >>