Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Programs are sorted by published date, most recent first.
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Ask the Experts
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ideas what the contamination is, and what caused it?
Ask the Experts
Is There a Passive Component Solder Void Limit?
Is There a Passive Component Solder Void Limit?
Is there a quality criteria for solder voids in passive components. Phil Zarrow and Jim Hall point to the answers.
Board Talk
Ask the Experts
What is Causing Solder Joint Cracking?
We are seeing field returns after a year in the field due to solder joint cracking on the pins of a 16 pin through-hole connector.
Ask the Experts
Causes of PCB Delamination
Causes of PCB Delamination
Industry expert Bob Willis explains the causes of PCB lamination defects.
Analysis Lab
Effects of Tin and Copper on Tin Whisker Formation
Effects of Tin and Copper on Tin Whisker Formation
This study examines the effect of adding grain refiners during tin electroplating with a focus on the associated incidence of whiskering.
Analysis Lab
Impact of Dust on PCB Assembly Reliability
Impact of Dust on PCB Assembly Reliability
What are the key characteristics of dust? Are some dust types worse than others? This paper presents some results towards answering these questions.
Analysis Lab
Collaboration to Combat Head on Pillowing Defects
Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab
The Effects of Flux Residues on Reliability
The Effects of Flux Residues on Reliability
Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance.
Analysis Lab
Tombstone Chip Caps Revisited
Tombstone Chip Caps Revisited
Tombstone defects for chip components are on the increase. Is it time to evaluate plating sensitivity when chip components are reflow soldered?
Production Floor
Ask the Experts
Cause of Cracking on SOT23 Components
We've encountered cracking with SOT-23 parts. Board support is a likely cause. Could there be any other explanation?
Ask the Experts
Contamination, Defects, Whiskers << Page 1 of 9 >>
 
 
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