Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. Programs are sorted by published date, most recent first.


Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab

Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab

Surface Mount Warpage Case Study
Surface Mount Warpage Case Study
A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile.
Analysis Lab

Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab

Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Jim Hall and Phil Zarrow, The Assembly Brothers, share their experiences.
Board Talk

Process Control of Ionic Contamination in Assembly of Electronic Circuits
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab

Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor

Nickel Hydroxide Corrosion Residues on Ceramic Packages
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab

Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor

We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk

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