Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Head-On-Pillow Defect - A Pain in the Neck
Head-On-Pillow Defect - A Pain in the Neck
The head on pillow defect is becoming more common. This paper describes an occurrence for an OEM and explains how it was dealt with.
Analysis Lab
Ask the Experts
Dendritic Growth/Contamination at BGA Sites
We have assemblies soldered with active flux that were not properly cleaned. We're experiencing latent failures due to dendritic growth.
Ask the Experts
Intermetallic Crystals and Role in Microbridges
Intermetallic Crystals and Role in Microbridges
Several short circuit failures caused by copper tin intermetallic crystals, the root cause, and rework techniques that can be used to prevent its occurrence.
Analysis Lab
Solder Paste Residue Corrosivity Assessment
Solder Paste Residue Corrosivity Assessment
Although SIR and ECM tests are used to evaluate the solder paste residue corrosivity, a more selective method, the Bono test, has been developed.
Analysis Lab
Ask the Experts
Circuit Board Bow and Twist
Board flexing has recently started to occur on one of our circuit board assemblies. This assembly has a 40 mm PoP BGA component. Any help is appreciated.
Ask the Experts
Ask the Experts
Cause of Voids in Leadless Packages
What is the primary cause of solder voiding in leadless packages such as BGA's?
Ask the Experts
Ask the Experts
Tacky Substance Under Zero Clearance Parts
We are having failures with large, flush sitting components. When we remove the parts we find a tacky substance. Is this residue common?
Ask the Experts
Analysis of Laminate Material Properties for Correlation to Pad Cratering
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab
Ask the Experts
What Causes Black Pad?
What is the primary cause of Black Pad and/or pad contamination during the assembly process?
Ask the Experts
Reducing Defects with Embedded Sensing
Reducing Defects with Embedded Sensing
This paper covers sensing technologies to guarantee that only good PCBs pass the assembly process, reducing rework and improving efficiency.
Materials Tech
Contamination, Defects, Whiskers << Page 1 of 9 >>