Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. Programs are sorted by published date, most recent first.


Nickel Hydroxide Corrosion Residues on Ceramic Packages
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab

Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor

We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk

Characterization, Prevention and Removal of Particulate Matter on PCBs
Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab

Corrosion and Contaminant Diffusion Multi-Physics Model
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab

What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk

Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk

Last Will and Testament of the BGA Void
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab

Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

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