Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. Programs are sorted by published date, most recent first.


Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab

Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
Analysis Lab

Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? How can having high particle concentration affect our PCB assembly process, printing process, reflow, etc.?
Board Talk

Collaboration to Combat Head on Pillowing Defects
Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab

Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions.
Board Talk

OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab

Novel Approaches for Minimizing Pad Cratering
Novel Approaches for Minimizing Pad Cratering
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented.
Production Floor

Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab

Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab

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