Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

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What is Causing Oxidation?
After 2-3 months in the field we are noticing the silver connectors on our circuit boards have turned black, and appear to have heavy oxidation.
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Hand Sanitizers and Risks to Electronics
Hand Sanitizers and Risks to Electronics
This paper examines typical hand sanitizers and hand lotions and their impact on high reliability electronic hardware.
Analysis Lab
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What Causes Solder Voids In Leadless Packages?
What is the primary cause of solder voiding in leadless packages such as BGA's?
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Ask the Experts
Concerns Using Hand Sanitizers
Many of our operators have been using hand sanitizers. Should we be concerned that are contaminating our circuit board assemblies?
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Ask the Experts
Puzzling PCB Reflow Delamination Problem
PCBs passed through our reflow system at 230 C and most had issues with delamination. Where should we look to solve this problem?
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 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab
Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
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Gold Contact Flux Contamination Failures
We have assemblies with contamination on the gold edge contacts that is flux residue. Can this cause functionality problems?
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Ask the Experts
What Causes Oxidation on SMT Pads?
What causes oxidation on surface mount pads? We believe oxidation on BGA pads is resulting in poor solder joints.
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Causes of Popcorn Defects in Plastic Packages
Causes of Popcorn Defects in Plastic Packages
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of popcorning (distortion) on plastic packages like QFPs, SOICs and BGAs.
Analysis Lab
Contamination, Defects, Whiskers << Page 1 of 9 >>
 
 
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