Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

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Effect of Soldering and Flux on Whisker Growth
Effect of Soldering and Flux on Whisker Growth
This paper relates trends in whisker growth to observations of corrosion of solder as related to the type of flux used.
Analysis Lab
OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab
Ask the Experts
Lead-Free Solder Contaminated with Lead
Our wave solder pot contains lead free solder. Analysis indicates it contains 0.12% lead. The maximum allowed is 0.10%. Is there anything we can do?
Ask the Experts
We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk
Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab
Investigation of Whisker Growth on Wire and Braid
Investigation of Whisker Growth on Wire and Braid
This paper presents data from humidity, temperature conditioning, and electron microscopy inspection of tin coated wire specimens of various size and age.
Analysis Lab
Surface Mount Warpage Case Study
Surface Mount Warpage Case Study
A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile.
Analysis Lab
Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab
Corrosive Driven Whisker Growth in SAC305
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Analysis Lab
Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies? The Assembly Brothers, Jim Hall and Phil Zarrow, use their expertise in the industry to answer this question.
Board Talk
Contamination, Defects, Whiskers << Page 1 of 9 >>
 
 
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