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Contamination, Defects, Whiskers | ||||||||||
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. | ||||||||||
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Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling. Board Talk The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components. Analysis Lab A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile. Analysis Lab When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Board Talk In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. Production Floor This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity. Analysis Lab This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production. Analysis Lab The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized. Analysis Lab Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages. Analysis Lab We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their own experiences. Board Talk |
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