Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 6 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Programs are sorted by published date, most recent first.
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Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions.
Board Talk
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab
Analysis of Laminate Material Properties for Correlation to Pad Cratering
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab
Novel Approaches for Minimizing Pad Cratering
Novel Approaches for Minimizing Pad Cratering
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented.
Production Floor
Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Jim Hall and Phil Zarrow, The Assembly Brothers, share their experiences.
Board Talk
Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab
Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
Analysis Lab
We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
Contamination, Defects, Whiskers << Page 1 of 6 >>