Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. Programs are sorted by published date, most recent first.


What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk

Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk

Last Will and Testament of the BGA Void
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab

Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? How can having high particle concentration affect our PCB assembly process, printing process, reflow, etc.?
Board Talk

Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions.
Board Talk

Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab

Analysis of Laminate Material Properties for Correlation to Pad Cratering
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab

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