Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

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Corrosive Driven Whisker Growth in SAC305
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Analysis Lab
Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies? The Assembly Brothers, Jim Hall and Phil Zarrow, use their expertise in the industry to answer this question.
Board Talk
Ask the Experts
LED Component Shift During Reflow
What can be the root cause of SMT LED Component Shift during reflow?
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Ask the Experts
Contaminated Joints Cause an Assembly to Fail RoHS Compliance
Can a few contaminated solder joints cause an entire assembly to fail? Some of the joints were cross-contaminated with leaded solder.
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Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab
Elimination of Whiskers from Electroplated Tin
Elimination of Whiskers from Electroplated Tin
Paper covers data to show the effect of two approaches on the dissipation of the stress, resulting from intermetallic compound formation.
Materials Tech
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor
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Components Falling Off During Wave Soldering
We are facing a problem with components falling off during PCB wave soldering. Could the problem be caused by the lacquer coating on the PCBs?
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Process Control of Ionic Contamination in Assembly of Electronic Circuits
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab
Contamination, Defects, Whiskers << Page 1 of 9 >>
 
 
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