Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers << Page 1 of 9 >>
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Programs are sorted by published date, most recent first.
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What Causes Black Pad?
What is the primary cause of Black Pad and/or pad contamination during the assembly process?
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Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk
Novel Approaches for Minimizing Pad Cratering
Novel Approaches for Minimizing Pad Cratering
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented.
Production Floor
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What is Causing Solder Joint Cracking?
We are seeing field returns after a year in the field due to solder joint cracking on the pins of a 16 pin through-hole connector.
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Void Reduction in Bottom Terminated Components Using Vacuum Assist
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab
Corrosion and Contaminant Diffusion Multi-Physics Model
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab
We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question and share their insight.
Board Talk
Last Will and Testament of the BGA Void
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
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Contaminated Joints Cause an Assembly to Fail RoHS Compliance
Can a few contaminated solder joints cause an entire assembly to fail? Some of the joints were cross-contaminated with leaded solder.
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Contamination, Defects, Whiskers << Page 1 of 9 >>