Electronics Assembly Knowledge, Vision & Wisdom
Contamination, Defects, Whiskers
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. Programs are sorted by published date, most recent first.


Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab

Analysis of Laminate Material Properties for Correlation to Pad Cratering
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab

What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk

Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk

Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab

Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
Analysis Lab

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