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These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions. Programs are sorted by published date, most recent first.
Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
High Reliability Techniques For Benchtop PCB Cleaning
The purpose of this study was to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked circuit boards.
Cleaning R.F. Circuits - Aqueous or Vapor?
We clean R.F. assemblies by hand but want to switch to an automated process. Which process would be better vapor degreasing or aqueous? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
PCBA Cleaning with Sodium Bicarbonate
Is there an effect on PCBA long-term reliability when cleaned with a sodium bicarbonate scrub followed by DI water rinse? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Results with Benchtop PCB Cleaning
This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process.
Video Analysis of Solder Paste Release from Stencil Printing
Solder paste release from the stencil is a critical factor in print quality. An experiment used a video microscope to capture the separation of the stencil.
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