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These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions. Programs are sorted by published date, most recent first.
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
PCBA Cleaning with Sodium Bicarbonate
Is there an effect on PCBA long-term reliability when cleaned with a sodium bicarbonate scrub followed by DI water rinse? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Video Analysis of Solder Paste Release from Stencil Printing
Solder paste release from the stencil is a critical factor in print quality. An experiment used a video microscope to capture the separation of the stencil.
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Results with Benchtop PCB Cleaning
This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process.
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
How Clean is Clean Enough
This research determined at what level each ionic contaminant on nominal lead spacing in electronic hardware will cause current leakage and corrosion.
Dissolution of Metal Foils in Common Beverages
In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined.
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
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