Electronics Assembly Knowledge, Vision & Wisdom
Cleaning, Washing, Solvents
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These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions. Programs are sorted by published date, most recent first.


HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech

No-Clean Residue Shorts
No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations?
Board Talk

Is No-Clean the Trend for QFN Components?
Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Cleaning R.F. Circuits - Aqueous or Vapor?
Cleaning R.F. Circuits - Aqueous or Vapor?
We clean R.F. assemblies by hand but want to switch to an automated process. Which process would be better vapor degreasing or aqueous? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
Materials Tech

PCBA Cleaning with Sodium Bicarbonate
PCBA Cleaning with Sodium Bicarbonate
Is there an effect on PCBA long-term reliability when cleaned with a sodium bicarbonate scrub followed by DI water rinse? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk

Video Analysis of Solder Paste Release from Stencil Printing
Video Analysis of Solder Paste Release from Stencil Printing
Solder paste release from the stencil is a critical factor in print quality. An experiment used a video microscope to capture the separation of the stencil.
Analysis Lab

Delay Before Cleaning Partial Assemblies
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
Board Talk

Effect of SMT Component Package Design on Cleaning Effectiveness
Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Production Floor

Results with Benchtop PCB Cleaning
Results with Benchtop PCB Cleaning
This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process.
Production Floor

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