Electronics Assembly Knowledge, Vision & Wisdom
Cleaning, Washing, Solvents
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These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions. Programs are sorted by published date, most recent first.


How Clean is Clean Enough
How Clean is Clean Enough
This research determined at what level each ionic contaminant on nominal lead spacing in electronic hardware will cause current leakage and corrosion.
Analysis Lab

Dissolution of Metal Foils in Common Beverages
In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined.
Analysis Lab

Is Cleaning Critical to POP Assemblies?
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
Production Floor

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor

Cleaning High Reliability Assemblies with Tights Gaps
Cleaning High Reliability Assemblies with Tights Gaps
The purpose of this designed experiment was to evaluate the effectiveness of a variety of cleaning agents under an array of process conditions.
Production Floor

Seeking Alternatives to Solvent Cleaning
Seeking Alternatives to Solvent Cleaning
We are currently using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene and request your input. The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk

Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk

Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech

Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
This study qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab

HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech

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