Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
Previous   Page 1 of 32   Next


Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
This article studies a new low melting temperature solder interconnect application and reliability on various product categories.
Analysis Lab

Risk for Ceramic Component Cracking Dependent
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

Embracing a New Paradigm: Electronic Work Instructions (EWI)
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab

Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab

Effect of TIM Compression Loads on BGA Reliability
Effect of TIM Compression Loads on BGA Reliability
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability.
Analysis Lab

Rework and Reball Challenges for Wafer-Level Packages
Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab

Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab

Component Density on Solder Joint Reliability Under Harsh Environment
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search