Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Alloy Composition and Aging on the Survivability of Lead-Free Solders
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab

Evaluation of the Use of ENEPIG in Small Solder Joints
Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Analysis Lab

Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Analysis Lab

Enhance the Shock Performance of Ultra-Large BGA Components
Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
Analysis Lab

Electrochemical Methods to Measure Corrosion Potential of Flux Residue
Electrochemical Methods to Measure Corrosion Potential of Flux Residue
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings.
Analysis Lab

Assembly Reliability of TSOP/DFN PoP Stack Package
Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Analysis Lab

Selective Soldering Design for Reliability Using SIR Test Method
Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Conformal Coating - Performance Comparison Environmental Testing
Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
Analysis Lab

Ball Pull Test Efficiency for the PCB Pad Cratering Validation
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab

The Impact of VIA and Pad Design on QFN Assembly
The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab

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