Analysis Lab



Analysis Lab
Corrosion, Contamination, Data Acquisition, ESD, EOS, Inspection, Measurement, Profiling, Reliability, RFID, Solder Defects, Tombstoning, X-ray
Previous
 Page 1 of 70 
Next
Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

Board  Processes and Effects on Fine Copper Barrel Cracks
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
Analysis Lab

TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab

Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab

Previous
 Page 1 of 70 
Next