Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Grain Refinement for Improved Lead-Free Joint Reliability
Grain Refinement for Improved Lead-Free Joint Reliability
In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed.
Analysis Lab

Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between these two families of solder pastes to guide users in their choice.
Analysis Lab

The Perfect Copper Surface
The Perfect Copper Surface
To provide the functionality in today's electronics, printed circuit boards are approaching the complexity of semiconductors.
Analysis Lab

Collaboration to Combat Head on Pillowing Defects
Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab

Dielectric Material Damage vs, Conductive Anodic Filament Formation
Dielectric Material Damage vs, Conductive Anodic Filament Formation
Our objective is to establish correlation between the various types of material damage and the propensity to CAF failure.
Analysis Lab

Generalizations About Component Flatness
Generalizations About Component Flatness
Failure to have completely flat components and circuit boards can lead to opens, shorts, head on pillow, weakened solder joints and stressed solder joints.
Analysis Lab

Hybrid Conformal Coatings Used for Mitigating Whisker Growth
Hybrid Conformal Coatings Used for Mitigating Whisker Growth
In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments.
Analysis Lab

Mixed Metals Impact on Reliability
Mixed Metals Impact on Reliability
This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability.
Analysis Lab

A New Method to Forecast Drop Shock Performance
A New Method to Forecast Drop Shock Performance
This paper discusses a method to predict drop test behavior by understanding the surface tension of the solder mask ink and the underfill.
Analysis Lab

Method to Measure Intermetallic Layer Thickness
Method to Measure Intermetallic Layer Thickness
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed.
Analysis Lab

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