Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 34 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System
Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System
Dip soldering remains a common attachment method due to its simplicity, robustness, uniformity and low cost for a number of applications [1]. In particular, the soldering of enameled copper wires to a terminal such as required when making transformers, inductors, electromagnets, motors, solenoids and other devices are often performed by dip soldering.
Analysis Lab
Head-On-Pillow Defect - A Pain in the Neck
Head-On-Pillow Defect - A Pain in the Neck
The head on pillow defect is becoming more common. This paper describes an occurrence for an OEM and explains how it was dealt with.
Analysis Lab
Side Wall Wetting Induced Void Formation
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
Reliability Study of Low Silver Alloy Solder Pastes
Reliability Study of Low Silver Alloy Solder Pastes
Paper presents the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling tests.
Analysis Lab
Intermetallic Crystals and Role in Microbridges
Intermetallic Crystals and Role in Microbridges
Several short circuit failures caused by copper tin intermetallic crystals, the root cause, and rework techniques that can be used to prevent its occurrence.
Analysis Lab
New Paradigm for Optical/X-Ray Inspection
New Paradigm for Optical/X-Ray Inspection
This paper describes a concept for a test system where a low energy micro focus X-ray source and 4 mega pixel detector are mounted in separate robotically controlled heads.
Analysis Lab
Solder Paste Residue Corrosivity Assessment
Solder Paste Residue Corrosivity Assessment
Although SIR and ECM tests are used to evaluate the solder paste residue corrosivity, a more selective method, the Bono test, has been developed.
Analysis Lab
NASA DoD Environments Testing Results
NASA DoD Environments Testing Results
NASA-DoD combined environments testing was performed to validate and demonstrate lead-free solders as replacements for tin-lead solders.
Analysis Lab
CVS Control of Via Fill Acid Copper Electroplating Baths
CVS Control of Via Fill Acid Copper Electroplating Baths
This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths.
Analysis Lab
Embedded Components: Analysis of Reliability
Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components compared to that of standard SMT components.
Analysis Lab
Analysis Lab << Page 1 of 34 >>