Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 25 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

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Effect of Soldering and Flux on Whisker Growth
Effect of Soldering and Flux on Whisker Growth
This paper relates trends in whisker growth to observations of corrosion of solder as related to the type of flux used.
Analysis Lab
Testing Intermetallic Fragility
Testing Intermetallic Fragility
Data is presented on the intermetallic strengths and failure modes of two bond pull test methods.
Analysis Lab
Electrical Test Conditions & Considerations
Electrical Test Conditions & Considerations
When an OEM is deciding requirements for a particular part regarding Electrical Test, some over precautions and disconnects may occur.
Analysis Lab
OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab
Corrosion Behavior of CU in Some Commercial Beverages
Corrosion Behavior of CU in Some Commercial Beverages
The corrosion behaviour of pure copper in selected commercial beverages was studied. Two approaches were used to investigate the corrosion behavior.
Analysis Lab
Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab
NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab
Elemental Composition of Cell Phones
Elemental Composition of Cell Phones
Different cells phones were disassembled, ground up, dissolved and analyzed for elemental content, for information about the metals present.
Analysis Lab
NASA Lead-Free Project: Mechanical Shock Test
NASA Lead-Free Project: Mechanical Shock Test
Paper covers mechanical shock testing conducted by Boeing Research and Technology for the NASA-DoD Lead-Free Electronics Solder Project.
Analysis Lab
Analysis Lab << Page 1 of 25 >>
 
 
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