Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 35 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Conformal Coating - Performance Comparison Environmental Testing
Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
Analysis Lab
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab
Microstructure and Performance of Micro CU Pillars Assemblies
Microstructure and Performance of Micro CU Pillars Assemblies
Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times.
Analysis Lab
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab
Living With PB-Free in High Performance Engineering Design
Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab
Last Will and Testament of the BGA Void
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab
The Impact of VIA and Pad Design on QFN Assembly
The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad footprint/stencil aperture designs. This study focuses on I/O pad stencil modifications.
Analysis Lab
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
In this paper, the different types of crack that can happen along the TSV/Si interface has been determined with the study of behaviors of crack.
Analysis Lab
NASA DOD SAC305/SN100C Copper Dissolution Testing
NASA DOD SAC305/SN100C Copper Dissolution Testing
In lead-free solder alloys, the reaction of the tin/copper is faster than of tin-lead solders/copper, which increases the degradation of the plated copper connections.
Analysis Lab
Analysis Lab << Page 1 of 35 >>