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Analysis Lab << Page 1 of 27 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

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pH Neutral vs. Alkaline Cleaning Agents
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Analysis Lab
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Inclusion Voiding in Gull Wing Solder Joints
Inclusion Voiding in Gull Wing Solder Joints
This paper provides definitions of the different voiding types encountered in gull wing solder joint geometries.
Analysis Lab
Reliability Assessment of Reballed BGAs
Reliability Assessment of Reballed BGAs
In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components.
Analysis Lab
Embracing a New Paradigm: Electronic Work Instructions (EWI)
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab
Effect of Encapsulation Materials on Tensile Stress
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab
Analysis of Warp-Induced PBGA Joint Failures
Analysis of Warp-Induced PBGA Joint Failures
In this paper, the numerical analysis of warpage in PBGA and PCBA is carried out in consideration of the residual stresses produced during SMT reflow process.
Analysis Lab
Analysis Lab << Page 1 of 27 >>