Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 33 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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A Control-Chart Based Method for Solder Joint Crack Detection
A Control-Chart Based Method for Solder Joint Crack Detection
The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and find out which failure criterion can detect failure sooner.
Analysis Lab
SMT Adhesive Inspection
SMT Adhesive Inspection
Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.
Analysis Lab
Study of Various PCBA Surface Finishes
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated. A total of nine groups of PCB were evaluated.
Analysis Lab
Signal Loss in a High Speed High Frequency Transmission Line
Signal Loss in a High Speed High Frequency Transmission Line
High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry.
Analysis Lab
Study on Solder Joint Reliability of Fine Pitch CSP
Study on Solder Joint Reliability of Fine Pitch CSP
In the future more fine pitch CSP components will be required. However, product reliability has been a big challenge with the fine pitch CSPs.
Analysis Lab
What is Kelvin Test?
What is Kelvin Test?
This paper uses data to outline what a 4-wire Kelvin test. Several examples are illustrated of what the 4 wire Kelvin test can and cannot do.
Analysis Lab
Reliability of Lead-Free LGAs and BGAs
Reliability of Lead-Free LGAs and BGAs
A theory is proposed that substantial differences in SAC305 solder joint Sn grain morphology may explain, at least partially.
Analysis Lab
Simulation of Embedded Component
Simulation of Embedded Component
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level.
Analysis Lab
Quantitative Analysis of Corrosion Resistance
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
Analysis Lab
Analysis Lab << Page 1 of 33 >>