Analysis Lab



Analysis Lab
Corrosion, Contamination, Data Acquisition, ESD, EOS, Inspection, Measurement, Profiling, Reliability, RFID, Solder Defects, Tombstoning, X-ray
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A Method to Investigate PCB Supplier Rework Processes and  Best Practices
A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab

EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab

NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab

Single Device Traceability in Assembly without ECID
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab

Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab

Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

Effects of Composition and Isothermal Aging on Microstructure Performance
Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab

Wettable-Flanks On Bottom-Termination Components in Mass Production
Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab

Fracture of Lead-Free Joints
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab

Optimization of Robotic Soldering Process: Solder Spread and Spattering
Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Analysis Lab

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