Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 33 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Predicting the Lifetime of the PCB
Predicting the Lifetime of the PCB
This paper examines a concept to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Analysis Lab
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Analysis Lab
Void Reduction in Reflow Soldering Processes by Sweep Stimulation
Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Analysis Lab
Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab
Via-In Pad Plated Over (VIPPO) Design Considerations
Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
The delta of the thermal cycle and dwell at each end of the thermal cycle are determined to be significant contributors.
Analysis Lab
Top 5 BGA Rework Challenges to Overcome
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Analysis Lab
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Described is work to improve solder-joint reliability of 0.8mm pitch BGA packages used in automotive under-the-hood applications.
Analysis Lab
Understanding PCB Design Variables That Contribute to Warpage
Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Analysis Lab
Quantifying Stencil Aperture Wall Quality
Quantifying Stencil Aperture Wall Quality
This paper discusses a method for the measurement of stencil aperture wall roughness, producing quantifiable results which can predict paste release performance.
Analysis Lab
Analysis Lab << Page 1 of 33 >>