Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


The Quest for Reliability Standards
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab

Impact of Lead-Free Components for High Reliability
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab

Board  Processes and Effects on Fine Copper Barrel Cracks
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
Analysis Lab

Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Analysis Lab

Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab

TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab

Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between two families of solder pastes to guide users in their choice.
Analysis Lab

Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
Analysis Lab

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