Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


The Effects of Solder Powder Size on Solder Paste Performance
The Effects of Solder Powder Size on Solder Paste Performance
Testing was conducted to measure each of these solders paste performance attributes for solder powders in both water-soluble and no clean solder pastes.
Analysis Lab

Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab

SIR Test Method for Developing Evidence for the Production Assembly
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab

Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab

Realization of a New Concept for Power Chip Embedding
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab

Fracture of Lead-Free Solder Joints
Fracture of Lead-Free Solder Joints
This study extended the quasi-static approach to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab

Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
This study looks to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized was found within the PCQR2 Database document.
Analysis Lab

The use of an available Color Sensor for Burn-In of LED Products
The use of an available Color Sensor for Burn-In of LED Products
This system will monitor the intensity and colour changes of a product while it is running and alert the engineer of early failures allowing the test to terminate, and faults to be examined.
Analysis Lab

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