Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 33 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Measuring Copper Surface Roughness for High Speed Applications
Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of light interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative.
Analysis Lab
Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability
Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability
The effects of dielectric material, aspect ratio, via morphology, surface prep, temperature and copper plating on microvia reliability are evaluated.
Analysis Lab
Acoustic Micro Imaging Analysis for 3D Packages
Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages has driven the adoption of high density interconnects that allow for an increased I/Os.
Analysis Lab
Board  Processes and Effects on Fine Copper Barrel Cracks
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
Analysis Lab
Impact of Lead-Free Components for High Reliability
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab
The Quest for Reliability Standards
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Analysis Lab
Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab
Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
Analysis Lab << Page 1 of 33 >>