Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 26 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Analysis Lab
The Quest for Reliability Standards
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab
Reliability of Sn/Cu/Ni Solder Joints
Reliability of Sn/Cu/Ni Solder Joints
Paper covers the electronics industry search for a single lead-free alloy that can be used throughout the manufacturing line.
Analysis Lab
Hand Sanitizers and Risks to Electronics
Hand Sanitizers and Risks to Electronics
This paper examines typical hand sanitizers and hand lotions and their impact on high reliability electronic hardware.
Analysis Lab
Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab
TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab
Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between two families of solder pastes to guide users in their choice.
Analysis Lab
How to Measure Thermal Zones with Blind Vias
How to Measure Thermal Zones with Blind Vias
IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias.
Analysis Lab
HALT Testing of Backward Soldered BGAs on a Military Product
HALT Testing of Backward Soldered BGAs on a Military Product
This study evaluates reliability in a production design. Functional assemblies were built using Pb-free BGAs in a SnPb solder process and subjected to life testing.
Analysis Lab
Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab
Analysis Lab << Page 1 of 26 >>
 
 
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication