Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 25 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Corrosive Driven Whisker Growth in SAC305
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Analysis Lab
Pb-Free Thermal Cycle Acceleration Factors
Pb-Free Thermal Cycle Acceleration Factors
Paper discusses the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb.
Analysis Lab
BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints.
Analysis Lab
Predicting the Lifetime of the PCB
Predicting the Lifetime of the PCB
This paper examines a concept to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Analysis Lab
Drop Test Performance of BGA Assemblies
Drop Test Performance of BGA Assemblies
In this work, BGA solder spheres using SAC105 with 0.02% addition of Titanium were evaluated for BGA assembly drop test performance.
Analysis Lab
Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
The delta of the thermal cycle and dwell at each end of the thermal cycle are determined to be significant contributors.
Analysis Lab
Analysis of Voiding Under QFN Packages
Analysis of Voiding Under QFN Packages
Paper covers results of experiments on QFN devices when the ensuing voiding level was calculated by x-ray inspection.
Analysis Lab
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Described is work to improve solder-joint reliability of 0.8mm pitch BGA packages used in automotive under-the-hood applications.
Analysis Lab
Analysis Lab << Page 1 of 25 >>
 
 
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication