Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab

Advanced Second Level Assembly Analysis Techniques
Advanced Second Level Assembly Analysis Techniques
This analysis method provides new capabilities when planning and monitoring the assembly interface to help predict and compensate for defects.
Analysis Lab

Corrosion Behavior of CU in Some Commercial Beverages
Corrosion Behavior of CU in Some Commercial Beverages
The corrosion behaviour of pure copper in selected commercial beverages was studied. Two approaches were used to investigate the corrosion behavior.
Analysis Lab

Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab

Electrical Test Conditions & Considerations
Electrical Test Conditions & Considerations
When an OEM is deciding requirements for a particular part regarding Electrical Test, some over precautions and disconnects may occur.
Analysis Lab

Recent Technology Advances for X-ray Inspection
Recent Technology Advances for X-ray Inspection
This paper reviews x-ray system types and what they provide for resolution, magnification, power, pixel size and the effects of radiation damage.
Analysis Lab

NASA DOD Phase 2: Copper Dissolution Testing
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab

EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab

Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab

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