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Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Realization of a New Concept for Power Chip Embedding
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab

Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab

Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

The use of an available Color Sensor for Burn-In of LED Products
The use of an available Color Sensor for Burn-In of LED Products
This system will monitor the intensity and colour changes of a product while it is running and alert the engineer of early failures allowing the test to terminate, and faults to be examined.
Analysis Lab

Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
This study looks to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized was found within the PCQR2 Database document.
Analysis Lab

Fracture of Lead-Free Solder Joints
Fracture of Lead-Free Solder Joints
This study extended the quasi-static approach to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab

How to Manage Material Outgassing in Reflow Oven
How to Manage Material Outgassing in Reflow Oven
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared.
Analysis Lab

BTC-QFN Test Board Design for Qualifying Soldering Materials
BTC-QFN Test Board Design for Qualifying Soldering Materials
This research uses a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components.
Analysis Lab

Acceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys
This paper describes initial test results for low-silver alloys using solder paste alloy assessment protocols for BGAs and leaded components.
Analysis Lab

Board Level Failure Analysis Demount Challenges Package Package
Board Level Failure Analysis Demount Challenges Package Package
Board level FA and component demount experiments for PoP mounted on PCB is discussed. The FA methods includes 2D and 3D X-ray imaging, cross section and DnP test.
Analysis Lab

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