Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Effect of Encapsulation Materials on Tensile Stress
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab

Component Density on Solder Joint Reliability Under Harsh Environment
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Pad Crater Initiation in Shock Using Acoustic Emission Detection
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab

NSOP Reduction for QFN RFIC Packages
NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes.
Analysis Lab

Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Analysis Lab

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab

Moisture Effects in Common Solderable RF Connector Dielectrics
Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Board Level Reliability Comparison of BGA and LGA Packages
Board Level Reliability Comparison of BGA and LGA Packages
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated.
Analysis Lab

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