Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 25 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

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Quantitative Analysis of Corrosion Resistance
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
Evaluating Accuracy of Thermocouple Attach Methods
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
Analysis Lab
The Effect of Radiation Losses on High Frequency PCB Performance
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper presented in 2013 that addressed microwave insertion loss of common PCB transmission line circuits.
Analysis Lab
Head in Pillow X-ray Inspection at Flextronics
Head in Pillow X-ray Inspection at Flextronics
For the study we used two boards exhibiting HIP defects with four types of AXI machines at four sites in Flextronics manufacturing, or vendor laboratory.
Analysis Lab
Embedded System Access
Embedded System Access
This paper discusses test access methodologies and elaborates on Embedded System Access strategies in particular.
Analysis Lab
Industry Standard Test for Pb-Free Alloys
Industry Standard Test for Pb-Free Alloys
This paper describes the progress of recent efforts by several groups to standardize lead-free solder alloy testing requirements.
Analysis Lab
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
In this study, an easy-to-implement test method to quantify the propensity for pad cratering in different PCB materials is presented.
Analysis Lab
Reliability Performance of Very Thin Boards
Reliability Performance of Very Thin Boards
This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups.
Analysis Lab
Tin Whisker Risk Management by Conformal Coating
Tin Whisker Risk Management by Conformal Coating
This study evaluates conformal coatings for mitigation of tin whisker growth. The coatings chosen for the experiment are acrylic, polyurethane and parylene.
Analysis Lab
Voiding Control at QFN Assembly
Voiding Control at QFN Assembly
Thermal pad voiding control at QFN assembly is a major challenge due to the large coverage area, large number of via, and low standoff.
Analysis Lab
Analysis Lab << Page 1 of 25 >>
 
 
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