Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 33 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Mixed Metals Impact on Reliability
Mixed Metals Impact on Reliability
This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability.
Analysis Lab
Hybrid Conformal Coatings Used for Mitigating Whisker Growth
Hybrid Conformal Coatings Used for Mitigating Whisker Growth
In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments.
Analysis Lab
Generalizations About Component Flatness at Elevated Temperature
The flatness of boards and components is an important topic. This study deals only with components.
Analysis Lab
Reterminated RoHS Components for SnPb Applications
Reterminated RoHS Components for SnPb Applications
This paper discusses a recent joint industry project to evaluate the retermination process on a range of electronic package styles.
Analysis Lab
Method to Measure Intermetallic Layer Thickness
Method to Measure Intermetallic Layer Thickness
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed.
Analysis Lab
New Requirements for Sir Measurement
New Requirements for Sir Measurement
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process.
Analysis Lab
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
This study qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab
Double Reflow-Induced Brittle Interfacial Failures
Double Reflow-Induced Brittle Interfacial Failures
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints.
Analysis Lab
Reliability Challenges for Bottom Termination Components
Reliability Challenges for Bottom Termination Components
Electro-chemical reliability, assembly defects, and alloy reliability are addressed and challenges for BTCs, solutions, and strategies for optimization.
Analysis Lab
Improving Density in Microwave Multilayer PCBs
Improving Density in Microwave Multilayer PCBs
Paper presents work performed to achieve LCP-based high density multilayer structures, describing the breadboards manufactured and tested.
Analysis Lab
Analysis Lab << Page 1 of 33 >>