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Analysis Lab
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more. Programs are sorted by published date, most recent first.


Via-In Pad Plated Over (VIPPO) Design Considerations
Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab

Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab

Void Reduction in Reflow Soldering Processes by Sweep Stimulation
Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Analysis Lab

Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Described is work to improve solder-joint reliability of 0.8mm pitch BGA packages used in automotive under-the-hood applications.
Analysis Lab

Top 5 BGA Rework Challenges to Overcome
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Analysis Lab

Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
The delta of the thermal cycle and dwell at each end of the thermal cycle are determined to be significant contributors.
Analysis Lab

Tin Flakes/Splashes in SMT
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab

Quantifying Stencil Aperture Wall Quality
Quantifying Stencil Aperture Wall Quality
This paper discusses a method for the measurement of stencil aperture wall roughness, producing quantifiable results which can predict paste release performance.
Analysis Lab

Understanding PCB Design Variables That Contribute to Warpage
Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Analysis Lab

Restoration of Lead-Free Bismuth Containing Solder Joints
Restoration of Lead-Free Bismuth Containing Solder Joints
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu).
Analysis Lab

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