Electronics Assembly Knowledge, Vision & Wisdom
Analysis Lab << Page 1 of 34 >>
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.

Programs are sorted by published date, most recent first.
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Protocol Development for Testing Solder Reliability
Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Analysis Lab
Cross-Sectioning of SMT and PCB Related Architectures
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab
Room Temperature Fast Flow Reworkable Underfill for LGA
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab
Embracing a New Paradigm: Electronic Work Instructions (EWI)
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Risk for Ceramic Component Cracking Dependent
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab
Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab
Rework and Reball Challenges for Wafer-Level Packages
Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab
Effect of Encapsulation Materials on Tensile Stress
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab
Analysis Lab << Page 1 of 34 >>