Adhesives, Coating, DispensingThese programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more. |
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The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies. Production Floor
This paper discusses a recent joint industry project to evaluate the retermination process on a range of electronic package styles. Analysis Lab
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering? Board Talk
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles. Materials Tech
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots. Production Floor
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages. Production Floor
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses. Materials Tech
The need to implement a tin whisker mitigation strategy has led to applying conformal coating over no clean residues. Production Floor
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Production Floor
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics. Materials Tech |
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