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These programs cover adhesives, epoxies, bonding, coatings, dispensing and more. Programs are sorted by published date, most recent first.
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Exploring the Reliability Limits for Silicone Adhesives
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating.
Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
Ultra-thin fluoropolymer coatings were tested by industry approved test methods to determine whether this level of process was possible.
Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
In this study, concerns involving the reliability of probing different solder/flux compounds, the land configurations, the contact pressures and probe styles will be discussed in detail.
When To Use Adhesive To Bond SMT Components
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering?
Jetting Fine Lines onto 2D and 3D Electronic Packages
The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies.
Hybrid Conformal Coatings for Mitigating Tin Whiskers
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles.
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Aerosol Jet Printing of Conductive Epoxy for 3D
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots.
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