Electronics Assembly Knowledge, Vision & Wisdom
Adhesives, Coating, Dispensing << Page 1 of 8 >>
These programs cover adhesives, epoxies, bonding, coatings, dispensing and more.

Programs are sorted by published date, most recent first.
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SMT Adhesive Inspection
SMT Adhesive Inspection
Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.
Analysis Lab
How to Protect Internal Circuitry from a Harsh Environment
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Materials Tech
Signal Loss in a High Speed High Frequency Transmission Line
Signal Loss in a High Speed High Frequency Transmission Line
High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry.
Analysis Lab
Quantitative Analysis of Corrosion Resistance
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of the correct solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech
Tin Whisker Risk Management by Conformal Coating
Tin Whisker Risk Management by Conformal Coating
This study evaluates conformal coatings for mitigation of tin whisker growth. The coatings chosen for the experiment are acrylic, polyurethane and parylene.
Analysis Lab
A Novel Conformal Back-Up Material
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech
Shelf Life Before Conformal Coating
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? The Assembly Brothers, Phil Zarrow and Jim Hall, share their insight.
Board Talk
Evaluation and Qualification of Reworkable Underfill Materials
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech
Exploring the Reliability Limits for Silicone Adhesives
Exploring the Reliability Limits for Silicone Adhesives
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating.
Materials Tech
Adhesives, Coating, Dispensing << Page 1 of 8 >>