Electronics Assembly Knowledge, Vision & Wisdom
Adhesives, Coating, Dispensing
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These programs cover adhesives, epoxies, bonding, coatings, dispensing and more. Programs are sorted by published date, most recent first.


Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech

How to Protect Internal Circuitry from a Harsh Environment
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Materials Tech

Improving Reliability Through HALT and HASS Testing
Improving Reliability Through HALT and HASS Testing
Halt and Hass technology uses accelerated stresses to expose product flaws early in the design and manufacturing stage, improving product reliability.
Analysis Lab

The Importance of Conformal Coating Thickness and Edge Coverage
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech

DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

Shelf Life Before Conformal Coating
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? The Assembly Brothers, Phil Zarrow and Jim Hall, share their insight.
Board Talk

A Novel Conformal Back-Up Material
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech

Evaluation and Qualification of Reworkable Underfill Materials
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech

Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Production Floor

Issues Mixing Silicone and Acrylic Conformal Coatings
Issues Mixing Silicone and Acrylic Conformal Coatings
Our repair PWA assemblies have a silicone based conformal coating. During repair some of the coating is removed. Is there be a compatibility problem with the coatings? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk

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