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These programs cover adhesives, epoxies, bonding, coatings, dispensing and more. Programs are sorted by published date, most recent first.
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Lower Temperature Solder Joint Encapsulant
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? The Assembly Brothers, Phil Zarrow and Jim Hall, share their insight.
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