Electronics Assembly Knowledge, Vision & Wisdom HOME PROGRAMS DIRECTORY SUBSCRIBE ARCHIVE/TRANSLATE Adhesives, Coating, Dispensing << Page 1 of 8 >> These programs cover adhesives, epoxies, bonding, coatings, dispensing and more. Programs are sorted by published date, most recent first. Directory Search         Program Search         SMT Adhesive Inspection Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection. Analysis Lab How to Protect Internal Circuitry from a Harsh Environment Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices. Materials Tech Signal Loss in a High Speed High Frequency Transmission Line High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry. Analysis Lab Quantitative Analysis of Corrosion Resistance An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed. Analysis Lab DFX on High Density Assemblies This paper discusses selection of the correct solder paste based on end product and the need to conduct proper root cause analyses before making any material changes. Materials Tech Tin Whisker Risk Management by Conformal Coating This study evaluates conformal coatings for mitigation of tin whisker growth. The coatings chosen for the experiment are acrylic, polyurethane and parylene. Analysis Lab A Novel Conformal Back-Up Material Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits. Materials Tech Shelf Life Before Conformal Coating Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? The Assembly Brothers, Phil Zarrow and Jim Hall, share their insight. Board Talk Evaluation and Qualification of Reworkable Underfill Materials Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability. Materials Tech Exploring the Reliability Limits for Silicone Adhesives Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating. Materials Tech Adhesives, Coating, Dispensing << Page 1 of 8 >> About | Advertising | Archives | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms | Translate Circuit Insight 6 Liberty Square #2040, Boston MA 02109 USA Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager Copyright © Circuitnet Media LLC. All rights reserved. A Circuitnet Media Publication