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These programs cover adhesives, epoxies, bonding, coatings, dispensing and more. Programs are sorted by published date, most recent first.
A Robot's Place in SMT
SMT machines today are designed to pick and place from tape, tray, and sticks. Robots can handle these more efficiently than an operator.
Production Floor
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating?
Board Talk
Lower Temperature Solder Joint Encapsulant
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Materials Tech
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Materials Tech
Improving Reliability Through HALT and HASS Testing
Halt and Hass technology uses accelerated stresses to expose product flaws early in the design and manufacturing stage, improving product reliability.
Analysis Lab
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? The Assembly Brothers, Phil Zarrow and Jim Hall, share their insight.
Board Talk
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech
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