Electronics Manufacturing and Electronics Assembly

We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor

Super-Capable Robots to Share Human Labor
Technology can do more jobs formerly performed by humans. This could result in AI automating tasks in the production of goods, services and ideas.
Technology Briefing

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Analysis Lab

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Materials Tech

Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Generalizations About Component Flatness at Elevated Temperature
The flatness of boards and components is an important topic. This study deals only with components.
Analysis Lab

How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk

The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices.
Materials Tech

AI, Digitalization, & the Outlook for the U.S. Economy
Trends in U.S. demography are poised to complement the deployment of maturing AI and digitalization. This will transform industries and create new ones.
Technology Briefing

Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor

Reterminated RoHS Components for SnPb Applications
This paper discusses a recent joint industry project to evaluate the retermination process on a range of electronic package styles.
Analysis Lab

Pay Clerk Production Woes
A company was having quality control problems. Friday morning was when the problems happened, but why just on Fridays?
Mysteries of Science

The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

System to Efficiently Produce Solar Thermochemical Hydrogen

In a study recently published, engineers lay out the conceptual design for a system that can efficiently produce “solar thermochemical hydrogen.”
Technology Briefing

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Analysis Lab

Cu Conductive Paste as Via Filling Materials for Various Substrates

In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Materials Tech

Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Production Floor

Board Talk

No-Clean Residue Shorts

How To Strip Tin-Lead Solder From SMT Pads for RoHS

Larger Stencil Apertures and Type 4 Paste

What is the IPC Definition for Uncommonly Harsh?

Component Moisture Question?

Causes of Blowholes

How To Verify Cleanliness After Rework and Prior to Re-coating?

Assembling Boards with BGAs on Both Sides

MORE BOARD TALK

Questions and Comments

Component Moisture Question?

Would it be worth doing V/I testing on the BGA ...
Alan Lowne, Saelig Co. Inc.

Problem Meeting Minimum Hole Fill During Wave Soldering

Everything that has been described is correct. If it is ...
Juergen Friedrich, Ersa GmbH

Problem Meeting Minimum Hole Fill During Wave Soldering

Our past experience is that the use of an inert ...
Gregory K Arslanian, Air Products and Chemicals, Inc.

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